10M50DAF256C8G

The 10M50DAF256C8G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 256-ball L-BGA package. It integrates 50,000 logic elements and 1,677,312 total RAM bits with 178 general-purpose I/Os, delivering a compact, reconfigurable silicon element for commercial embedded designs.

Targeted at commercial applications, this device provides a balance of on-chip logic density, on-chip memory, and I/O capacity while operating from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C ambient range.

Key Features

• Core Logic — 50,000 logic elements providing substantial programmable fabric for custom digital functions and control logic.
• Memory — 1,677,312 total RAM bits to support buffering, packet processing, and state storage inside the FPGA fabric.
• I/O Capability — 178 I/O pins that enable connectivity to multiple external peripherals, sensors, and interface modules.
• Power — Operates from a core voltage supply range of 1.15 V to 1.25 V, suitable for designs specifying a defined core power budget.
• Package — 256-LBGA (256-FBGA, 17 × 17) package for compact board-level integration and reliable surface-mount assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial electronics deployments.
• Compliance — RoHS compliant, meeting common environmental and materials restrictions for electronic products.

Typical Applications

• Custom Logic and Prototyping — Implement custom digital logic, glue logic, and rapid prototypes using the device’s 50,000 logic elements and abundant on-chip RAM.
• I/O-Intensive Interfaces — Use the 178 I/Os to bridge multiple external peripherals, parallel buses, or mixed-signal front ends in embedded systems.
• Embedded Control and Signal Processing — Leverage the on-chip RAM and logic resources to implement control loops, data buffering, and basic signal processing tasks for commercial products.

Unique Advantages

• Substantial On-Chip Logic — 50,000 logic elements enable implementation of complex finite-state machines, data paths, and control logic without external ASICs.
• Generous Embedded Memory — 1,677,312 RAM bits support larger data buffers and local storage, reducing dependence on external memories.
• High I/O Count — 178 I/Os simplify board-level interfacing by accommodating multiple signals and buses directly to the FPGA.
• Space-Efficient Package — 256-LBGA (17 × 17) package offers a compact solution for high-density PCB layouts.
• Commercial Temperature Range — Rated for 0 °C to 85 °C, aligning with typical commercial electronics deployment environments.
• RoHS Compliant — Conforms to materials restrictions for regulatory and supply-chain consistency.

Why Choose 10M50DAF256C8G?

The 10M50DAF256C8G positions itself as a versatile, commercially rated FPGA that balances logic density, on-chip memory, and I/O capacity in a compact 256-LBGA package. Its specification set supports a wide range of embedded and system-level designs that require reconfigurable logic, local RAM, and substantial external interfacing.

Designed and manufactured by Intel, this MAX® 10 device is suitable for commercial design teams seeking a scalable, reprogrammable building block backed by an established FPGA vendor.

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