10M40SCE144I7G

IC FPGA 101 I/O 144EQFP
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 101 1290240 40000 144-LQFP Exposed Pad

Quantity 545 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O101Voltage2.85 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2500Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1290240

Overview of 10M40SCE144I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC

The 10M40SCE144I7G is an Intel MAX® 10 FPGA device delivering a balance of programmable logic, embedded memory, and I/O in a 144‑lead LQFP exposed‑pad package. It is provided as an industrial‑grade FPGA with specifications suited to embedded and industrial electronics projects that require on‑chip RAM, substantial logic capacity, and extended temperature operation.

Key attributes include 40,000 logic elements, 1,290,240 total RAM bits, 101 I/O, a 2.85 V to 3.465 V supply range, and an operating temperature range of −40 °C to 100 °C—providing a compact, single‑device option for moderate‑to‑high integration requirements.

Key Features

  • Core Logic — 40,000 logic elements for implementing complex combinational and sequential logic functions.
  • On‑chip Memory — 1,290,240 total RAM bits to support buffering, state storage, and local data processing without immediate need for external memory.
  • I/O Capacity — 101 general purpose I/O pins for connecting sensors, peripherals, and board‑level interfaces.
  • Voltage Supply — Operates from 2.85 V to 3.465 V, compatible with common 3.3 V system rails.
  • Package & Mounting — 144‑LQFP exposed pad (supplier device package 144‑EQFP 20×20) in a surface‑mount form factor.
  • Temperature & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C and -I7 speed grade.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 40,000 logic elements provide the capacity to integrate multiple functions into a single FPGA, reducing component count.
  • Substantial internal RAM: 1,290,240 RAM bits lower dependence on external memory for many control and buffering tasks.
  • Generous I/O count: 101 I/O pins support complex interfacing needs on a single device.
  • Industrial temperature capability: Rated from −40 °C to 100 °C to meet the needs of temperature‑challenging environments.
  • Compact, thermally aware package: 144‑LQFP with exposed pad supports surface‑mount assembly while providing an exposed pad for improved board‑level thermal conduction.
  • Standard supply compatibility: 2.85 V to 3.465 V range aligns with common 3.3 V system architectures for straightforward power design.

Why Choose 10M40SCE144I7G?

The 10M40SCE144I7G combines substantial logic capacity, on‑chip RAM, and flexible I/O in a compact, surface‑mount 144‑LQFP package rated for industrial temperatures. As part of the Intel MAX 10 family, it offers a defined device density and package option for designers targeting embedded, industrial, or other applications that require reliable, programmable logic with integrated memory.

Choose this part when your design requires a single FPGA with 40,000 logic elements, significant on‑chip RAM, an ample number of I/O, and industrial temperature range—delivering a practical balance of integration, thermal handling via the exposed pad package, and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for 10M40SCE144I7G.

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