10M40SCE144C8G

The 10M40SCE144C8G is an Intel MAX® 10 field-programmable gate array (FPGA) supplied in a 144‑lead LQFP exposed‑pad package. It delivers 40,000 logic elements and 1,290,240 total RAM bits in a compact surface-mount form factor for commercial-grade embedded designs.

Built for applications that require moderate programmable logic, on-chip memory and flexible I/O, this device supports designs operating from 2.85 V to 3.465 V and across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 40,000 logic elements to implement custom logic, glue logic, and moderate-density state machines and datapaths.
• Embedded Memory — 1,290,240 total RAM bits for on-chip buffering, FIFOs, and small lookup tables or frame storage.
• I/O Capacity — 101 I/O pins to interface with peripherals, sensors, and external devices in multi‑signal systems.
• Supply Voltage — Operates from 2.85 V to 3.465 V, enabling compatibility with a variety of system power rails.
• Package & Mounting — 144‑lead LQFP with exposed pad; supplier device package listed as 144‑EQFP (20×20); surface‑mount mounting for compact PCB layouts.
• Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant.
• Documentation — Supported by the Intel MAX 10 FPGA device datasheet covering electrical characteristics, configuration and timing specifications.

Typical Applications

• Embedded Control and Glue Logic — Use available logic elements and I/Os to consolidate peripheral interfaces and replace multiple discrete components.
• Local Data Buffering — On‑chip RAM (1,290,240 bits) supports buffering and small FIFO implementations for data flow management between subsystems.
• Prototyping and Custom Interfaces — 101 I/Os and programmable logic density enable implementation of custom bus adapters and prototype hardware accelerators.

Unique Advantages

• Compact, high-density logic: 40,000 logic elements provide substantial programmable capacity in a 144‑lead package, helping reduce board area compared with multi‑chip solutions.
• Integrated on‑chip RAM: 1,290,240 total RAM bits reduce dependency on external memory for many control and buffering tasks, simplifying BOM and layout.
• Flexible I/O count: 101 I/Os accommodate diverse peripheral connections without immediate need for external expanders.
• Broad supply compatibility: 2.85 V to 3.465 V operation allows straightforward integration with common system power rails.
• Surface-mount, exposed‑pad package: 144‑lead LQFP with exposed pad supports thermal and mechanical assembly for compact system designs.
• Commercial temperature suitability: Rated from 0 °C to 85 °C for standard commercial environments.

Why Choose 10M40SCE144C8G?

The 10M40SCE144C8G positions itself as a practical, programmable logic device for commercial embedded systems that need a balance of logic density, on‑chip memory, and flexible I/O in a compact surface‑mount package. Its supply voltage range, RoHS compliance, and documented electrical and timing characteristics make it suitable for integrators focused on predictable, verifiable designs.

This device is appropriate for engineers and procurement teams seeking a MAX 10 family FPGA offering scalable programmable resources and integrated RAM to reduce external components, simplify PCB routing and accelerate development cycles using documented device specifications.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the 10M40SCE144C8G. Technical documentation is available in the Intel MAX 10 FPGA device datasheet for detailed electrical and timing specifications.