10M50DAF256C6G

The 10M50DAF256C6G is a MAX® 10 field programmable gate array (FPGA) from Intel, supplied in a 256-LBGA package. It integrates significant programmable logic, on-chip RAM, and a high I/O count to address commercial embedded and digital system designs.

With 50,000 logic elements, 1,677,312 bits of on-chip RAM and 178 I/Os, this device targets mid-range applications that require compact integration and flexible I/O. It operates at a core supply between 1.15 V and 1.25 V and is specified for commercial temperature operation.

Key Features

• Core Logic  50,000 logic elements provide substantial programmable logic capacity for mid-range digital designs.
• On‑Chip Memory  1,677,312 bits of total RAM enable local data buffering, state storage, and small embedded memory needs without external RAM.
• I/O Capability  178 user I/Os support diverse peripheral connections and parallel interfaces for system integration.
• Power  Core voltage supply specified from 1.15 V to 1.25 V to match system power-rail constraints and enable predictable power budgeting.
• Package  256-LBGA footprint (supplier package: 256-FBGA, 17×17) offers a compact surface-mount solution for space-constrained PCBs.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial electronic applications.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.
• Mounting  Surface-mount package for automated PCB assembly processes.

Typical Applications

• Embedded Control Systems  Implement custom state machines, control logic and peripheral interfaces using the device's logic and on-chip RAM.
• Communications and Data Interfaces  Use the high I/O count for protocol bridging, parallel data transfer, and front-end interface tasks in commercial equipment.
• Prototyping and Product Development  Rapidly iterate hardware functions and validate digital designs in a compact, surface-mount form factor.
• User Interface and Peripheral Handling  Drive and monitor multiple sensors, switches, displays and other peripherals with available I/O and local RAM.

Unique Advantages

• Significant Logic Capacity: 50,000 logic elements provide headroom for complex mid-range designs without external ASIC development.
• Ample On‑Chip RAM: 1,677,312 bits of RAM reduce dependence on external memory for buffering and small data storage.
• High I/O Count: 178 I/Os simplify board-level routing and allow direct connections to multiple peripherals and interfaces.
• Compact, Assembly‑Friendly Package: 256-LBGA (256-FBGA, 17×17) delivers a small footprint for dense PCB layouts with surface-mount assembly.
• Low-Voltage Operation: 1.15 V to 1.25 V core supply enables integration into low-voltage power domains and predictable power planning.
• Commercial Temperature Range and RoHS Compliance: Designed for standard commercial environments and compliant with RoHS requirements.

Why Choose 10M50DAF256C6G?

The 10M50DAF256C6G balances programmable logic capacity, on-chip memory and a high I/O count in a compact 256-LBGA package, making it well suited for commercial embedded and digital designs that require integration without large board area. Its defined voltage range and commercial temperature rating provide predictable operating parameters for production systems.

As an Intel MAX® 10 FPGA, this part is positioned for designers seeking a mid-range, integrated FPGA solution that simplifies board-level architecture by combining logic, RAM and I/O in a single surface-mount package.

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