10M50DAF256I6G

The 10M50DAF256I6G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, featuring 50,000 logic elements and 1,677,312 bits of on-chip RAM. Packaged in a 256-LBGA (supplier device package: 256-FBGA, 17×17) surface-mount package and rated for industrial operation, it addresses programmable-logic needs where density, I/O count, and extended temperature range are required.

With a 178-pin I/O footprint and a core supply range of 1.15 V to 1.25 V, this device is suited for industrial embedded designs that need flexible, on-board programmable logic and memory resources while meeting RoHS environmental requirements.

Key Features

• Logic Capacity  50,000 logic elements provide substantial programmable logic resources for implementing custom algorithms, glue logic, and hardware accelerators.
• On-chip Memory  1,677,312 total RAM bits enable data buffering, small FIFOs, and local storage for performance-sensitive logic paths.
• I/O Resources  178 I/O pins support a wide range of external interfaces and system-level connectivity in a compact package.
• Power and Core Voltage  Operates with a core voltage supply between 1.15 V and 1.25 V, allowing designers to align power domains with system requirements.
• Package and Mounting  256-LBGA package (supplier device package: 256-FBGA, 17×17) in a surface-mount form factor for high-density board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments where extended ambient ranges are needed.
• Environmental Compliance  RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• Industrial Control Systems  Programmable logic and abundant I/O make the device suitable for control, monitoring, and interface bridging in industrial automation equipment within the specified temperature range.
• Embedded Processing and Acceleration  On-chip RAM and 50,000 logic elements enable implementation of custom accelerators, data-path processing, and protocol offloads in embedded platforms.
• Communications and I/O Aggregation  High I/O count supports multi-interface aggregation, protocol conversion, and I/O expansion tasks in networking and communications equipment.
• Prototyping and System Integration  Surface-mount 256-LBGA package and significant logic/memory density allow system designers to consolidate functions and iterate designs rapidly.

Unique Advantages

• Substantial Logic Resource: 50,000 logic elements provide the capacity to implement complex custom logic without immediate migration to larger devices.
• Significant On-Chip Memory: 1,677,312 bits of RAM reduce reliance on external memory for many buffering and local-storage use cases, simplifying board-level design.
• High I/O Count: 178 I/Os enable flexible connectivity options and multi-peripheral integration in a single device.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or wide-range environments common in industrial applications.
• Compact Surface-Mount Package: 256-LBGA / 256-FBGA (17×17) packaging allows dense PCB layouts and space-efficient system designs.
• RoHS Compliance: Environmentally compliant manufacturing aligns with regulatory requirements for commercial and industrial products.

Why Choose 10M50DAF256I6G?

The 10M50DAF256I6G combines a high logic element count, substantial on-chip RAM, and a 178-pin I/O complement in a compact industrial-rated package, making it a strong choice for embedded and industrial designs that require programmable logic density and extended temperature performance. Its surface-mount 256-LBGA footprint supports space-constrained PCBs while offering the I/O and memory resources needed for mid-range FPGA tasks.

Manufactured by Intel, this device fits designers and procurement teams looking for a RoHS-compliant FPGA option that balances integration, thermal headroom, and I/O flexibility for scalable, long-lived industrial applications.

Request a quote or submit an inquiry to evaluate 10M50DAF256I6G for your next design and receive pricing and availability information tailored to your requirements.