10M50DAF484C7G

The 10M50DAF484C7G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 484-ball BGA package. It provides a configurable logic fabric with 50,000 logic elements and on-chip RAM to support commercial embedded and system designs requiring substantial I/O and memory resources.

With 360 available I/Os, a compact 484-FBGA (23×23 mm) footprint and a supply voltage range of 1.15–1.25 V, this device targets commercial-grade applications that need high-density digital integration within a surface-mount form factor.

Key Features

• Logic Capacity  50,000 logic elements to implement complex custom logic, state machines and protocol bridging within a single FPGA device.
• On-Chip Memory  1,677,312 total RAM bits for buffering, FIFOs and small embedded data structures directly in the FPGA fabric.
• I/O Density  360 I/Os to support wide bus interfaces, multiple peripherals and external device connections.
• Package and Mounting  484-FBGA (23×23 mm) package in a surface-mount format for compact PCB integration and high pin count routing.
• Power  Operates from a core supply range of 1.15 V to 1.25 V, enabling designs that adhere to specified voltage domains.
• Operating Range & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• RoHS Compliance  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Embedded Control and Logic Consolidation  Integrate custom control logic, state machines and glue logic in commercial embedded systems using up to 50,000 logic elements.
• High‑I/O Interface Hubs  Aggregate and manage multiple parallel or serial interfaces utilizing 360 I/Os for system-level connectivity.
• On‑Board Data Buffering  Leverage 1,677,312 bits of on-chip RAM for buffering, packet queues or temporary data storage in communication and processing pipelines.

Unique Advantages

• Scalable logic density: 50,000 logic elements provide room to implement substantial custom logic without external glue components.
• Significant on‑chip RAM: 1,677,312 RAM bits reduce the need for external memory for many buffering and queueing tasks.
• High I/O count: 360 I/Os simplify integration with multiple peripherals and wide buses, reducing board-level complexity.
• Compact, high‑pin package: 484-FBGA (23×23 mm) balances pin density and PCB space for compact system designs.
• Commercial‑grade suitability: Rated 0 °C to 85 °C for standard commercial applications and RoHS compliant for environmental compatibility.
• Surface-mount form factor: Designed for modern PCB assembly processes with a surface-mount 484-BGA package.

Why Choose 10M50DAF484C7G?

The 10M50DAF484C7G positions itself as a commercial-grade MAX® 10 FPGA option that combines substantial logic density, abundant on-chip RAM and a high I/O count in a compact 484-FBGA package. It is appropriate for designers seeking a single-device solution to consolidate logic, manage multiple interfaces and implement embedded buffering without expanding PCB real estate.

This device is well suited for OEMs and embedded system designers who require predictable operating limits (1.15–1.25 V supply, 0 °C to 85 °C) and RoHS compliance while maintaining a high level of integration and flexibility within their commercial product lines.

Request a quote or submit an inquiry to receive pricing and availability information for the 10M50DAF484C7G and to discuss how it can fit into your next design.