10M50DAF484I7G

The 10M50DAF484I7G is an Intel MAX® 10 FPGA in a 484-ball BGA package designed for industrial-grade applications. It delivers a substantial logic capacity with 50,000 logic elements, 1,677,312 bits of on-chip RAM, and 360 general-purpose I/O pins.

Configured for surface-mount assembly in a 484-FBGA (23 × 23 mm) package, the device operates from a core supply range of 1.15 V to 1.25 V and is specified for an operating temperature range of −40 °C to 100 °C. The part is RoHS compliant.

Key Features

• Logic Capacity — 50,000 logic elements provide substantial programmable fabric for custom logic, state machines, and glue logic.
• On-Chip Memory — 1,677,312 total RAM bits support embedded data buffering, FIFOs, and small lookup-table storage without external memory.
• I/O Density — 360 I/O pins enable broad connectivity for parallel buses, external peripherals, and board-level interfaces.
• Power — Core voltage supply specified from 1.15 V to 1.25 V to match system power-rail requirements and enable stable core operation.
• Package & Mounting — 484-FBGA (23 × 23) BGA package, surface-mount, suitable for compact, high-density PCB layouts.
• Industrial Temperature Range — Rated for −40 °C to 100 °C to meet temperature demands of industrial applications.
• RoHS Compliance — Meets RoHS environmental requirements for restricted substances.

Typical Applications

• Embedded Logic Acceleration — Use the device where up to 50,000 logic elements are required to implement custom hardware acceleration, protocol handling, or real-time control logic.
• Interface Aggregation — 360 I/O pins support aggregation of multiple parallel and serial peripherals, enabling board-level protocol bridging and I/O expansion.
• On‑Chip Data Buffering — 1,677,312 bits of RAM are suitable for implementing FIFOs, buffering, and small on-chip data stores to reduce external memory dependence.

Unique Advantages

• High Logic Density: 50,000 logic elements provide headroom for complex designs without immediate need for larger devices.
• Substantial On-Chip Memory: 1,677,312 RAM bits reduce the need for external memory for many buffering and control tasks.
• Extensive I/O Count: 360 I/O pins give flexibility for multi-interface designs and high pin-count connectivity.
• Industrial Reliability: Specified for −40 °C to 100 °C operation to support demanding environmental conditions.
• Compact, Assembly-Friendly Package: 484-FBGA (23 × 23) surface-mount package enables dense PCB routing and automated assembly.
• Regulatory Compliance: RoHS compliant for simplified regulatory handling in global product designs.

Why Choose 10M50DAF484I7G?

The 10M50DAF484I7G balances significant programmable logic, on-chip memory, and a high I/O count in a compact 484-FBGA package rated for industrial temperatures. Its specified core voltage range and RoHS compliance make it suitable for designs that require predictable electrical characteristics and environmental conformity.

This device is well suited to engineers and procurement teams building mid-density FPGA-based solutions that need integrated RAM and extensive I/O without moving to larger package footprints. The combination of logic capacity, memory, and industrial temperature rating supports scalable, long-term deployments where uptime and consistent behavior across temperature extremes are important.

Request a quote or submit a specification inquiry to obtain pricing, availability, and additional procurement details for the 10M50DAF484I7G.