10M50DAF484I7P

The 10M50DAF484I7P is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, delivering a high-density programmable logic resource for embedded and industrial applications. It combines 50,000 logic elements with more than 1.6M bits of on-chip RAM and a 360-pin I/O capability to support complex control, interfacing and system-integration tasks.

Designed for surface-mount assembly in a compact 484-BGA package, this industrial-grade device operates across a wide temperature range and a low core voltage window, enabling designs that require robust operation, significant logic and memory capacity, and extensive I/O connectivity.

Key Features

• Logic Capacity  50,000 logic elements provide substantial programmable logic resources for complex combinational and sequential designs.
• On‑Chip Memory  1,677,312 total RAM bits for embedded buffers, FIFOs, and local data storage without external memory.
• I/O Density  360 I/O pins support extensive peripheral interfacing and multiple parallel interfaces.
• Power  Core supply voltage range of 1.15 V to 1.25 V to match low-voltage system designs.
• Package and Mounting  484-BGA package (supplier device package listed as 484-FBGA (23x23)) optimized for surface-mount PCB integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• Regulatory  RoHS compliant to meet standard environmental and manufacturing requirements.

Typical Applications

• Industrial Control & Automation  Use the device’s industrial temperature rating, large logic capacity and extensive I/O to implement motor control, PLC functions, and machine interface logic.
• Communications & Networking  High logic and memory resources with 360 I/Os enable protocol handling, packet buffering and custom interface bridging.
• Embedded Processing & Sensor Systems  On‑chip RAM and abundant logic elements support sensor data aggregation, preprocessing, and real-time signal conditioning.
• System Integration & Prototyping  Compact 484-BGA packaging and surface-mount mounting simplify integration of dense programmable logic into space-constrained boards.

Unique Advantages

• High Logic Density: 50,000 logic elements provide the capacity to implement complex custom logic and state machines on a single device.
• Significant On‑Chip Memory: 1,677,312 RAM bits reduce dependence on external memory for buffering and local data storage.
• Extensive I/O Count: 360 I/Os enable broad peripheral connectivity and parallel interfacing options without additional I/O expanders.
• Industrial Reliability: −40 °C to 100 °C operating range supports deployment in demanding industrial environments.
• Low-Voltage Core Support: 1.15 V to 1.25 V supply range accommodates low-power system architectures.
• RoHS Compliant Packaging: Environmentally compliant materials and surface-mount 484-BGA package aid manufacturability and regulatory alignment.

Why Choose 10M50DAF484I7P?

The 10M50DAF484I7P positions itself as a robust, high-capacity FPGA option for designs that need substantial programmable logic, on-chip memory, and a large number of I/Os in an industrial-grade package. Its combination of 50,000 logic elements, over 1.6M bits of RAM, and 360 I/Os makes it well suited to embed complex control functions, handle high I/O counts, and integrate multiple interfaces on a single device.

Engineers and procurement teams targeting industrial control, communications, or advanced embedded systems will find this device delivers integration benefits that can reduce BOM complexity and simplify board-level design while operating across a wide temperature and low-voltage range.

Request a quote or submit a procurement inquiry to receive pricing and availability for 10M50DAF484I7P and to discuss volume requirements or lead times.