10M50DAF484C8G

The 10M50DAF484C8G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel offered in a 484-BGA surface-mount package. It provides 50,000 logic element cells, 1,677,312 bits of on-chip RAM, and 360 user I/O pins, delivering a balance of logic density, memory, and connectivity for commercial electronic designs.

Designed for commercial-grade applications, the device operates from a 1.15 V to 1.25 V core supply and across an ambient temperature range of 0 °C to 85 °C, supporting designs that require moderate logic capacity and substantial I/O integration in a compact 23 × 23 mm FBGA footprint.

Key Features

• Core Logic: 50,000 logic element cells provide programmable fabric for custom logic implementation and complex state machines.
• On-Chip Memory: 1,677,312 total RAM bits to support embedded buffering, FIFOs, and memory-intensive logic functions.
• I/O Capacity: 360 user I/O pins enable broad external interfacing and parallel connectivity for peripherals and external devices.
• Power Supply: Core voltage range of 1.15 V to 1.25 V for the FPGA core power domain.
• Package and Mounting: 484-FBGA (23×23 mm) package, 484-BGA case, designed for surface-mount PCB assembly.
• Operating Environment: Commercial-grade operation from 0 °C to 85 °C.
• Regulatory: RoHS compliant.

Typical Applications

• Commercial Embedded Systems: Use the device where up to 50,000 logic elements and 360 I/Os are needed to implement custom control, protocol bridging, or I/O expansion.
• Digital Signal Processing Blocks: Leverage 1,677,312 bits of on-chip RAM to support buffering and intermediate storage for data-path implementations.
• Prototyping and System Integration: Implement custom logic and interface aggregation in compact, surface-mount 484-FBGA form factors for board-level development.

Unique Advantages

• Substantial Logic Density: 50,000 logic element cells enable the implementation of sizable custom logic without external programmable devices.
• Significant On-Chip Memory: Over 1.6 million bits of RAM reduce the need for external memory for many buffering and temporary storage tasks.
• High I/O Count: 360 I/Os support extensive parallel interfaces and multiple peripheral connections from a single FPGA.
• Compact, Surface-Mount Package: 484-FBGA (23×23 mm) provides a high-pin-count solution in a compact footprint suitable for densely populated PCBs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match commercial electronic product requirements.
• RoHS Compliance: Environmentally compliant for use in lead-free manufacturing processes.

Why Choose 10M50DAF484C8G?

The 10M50DAF484C8G positions itself as a versatile commercial-grade FPGA combining substantial logic resources, sizable on-chip RAM, and a high I/O count in a compact 484-FBGA package. Its electrical and thermal specifications—1.15 V to 1.25 V core supply and 0 °C to 85 °C operating range—make it suitable for a broad set of commercial embedded designs that require integrated logic and memory without external devices.

Engineers and procurement teams looking for a MAX® 10 FPGA with a balance of integration, I/O flexibility, and RoHS compliance will find this part appropriate for developing and scaling commercial products where board space and on-chip resources are key considerations.

Request a quote or submit a parts inquiry to receive pricing, availability, and ordering information for the 10M50DAF484C8G.