10M50DAF256I7G

The 10M50DAF256I7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel. It provides a combination of logic resources, on-chip memory, and I/O capacity in a compact 256-LBGA package intended for industrial-grade deployments.

With 50,000 logic elements, 1,677,312 total RAM bits, and 178 I/O pins, this device is suited to designs that require substantial programmable logic and memory resources while meeting industrial temperature and RoHS requirements.

Key Features

• Logic Capacity — 50,000 logic elements and 3,125 LABs, enabling complex programmable logic implementations.
• On-Chip Memory — 1,677,312 total RAM bits for data buffering, state storage, and local memory functions.
• I/O and Integration — 178 user I/O pins to support a wide range of peripheral interfaces and system interconnects.
• Power — Core supply range of 1.15 V to 1.25 V to match system power design constraints.
• Package and Mounting — 256-LBGA (supplier package: 256-FBGA, 17×17) in a surface-mount format for compact board-level integration.
• Industrial Grade and Temperature Range — Specified for industrial use with an operating temperature range of −40°C to 100°C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial control systems — Use the device's 50,000 logic elements and 178 I/Os to implement control logic, real-time interfacing, and protocol bridging in industrial equipment.
• Protocol bridging and interface consolidation — Leverage high I/O count and on-chip RAM to aggregate signals and translate between multiple bus and serial interfaces.
• Embedded logic and state machines — Implement complex state-based functions and local buffering using the available logic resources and 1,677,312 RAM bits.

Unique Advantages

• High logic density: 50,000 logic elements support substantial programmable logic and complex designs without external gate arrays.
• Significant on-chip memory: 1,677,312 total RAM bits reduce dependence on external memory for many buffering and state requirements.
• Generous I/O capability: 178 I/O pins enable direct connections to multiple peripherals and interfaces, simplifying board-level design.
• Industrial suitability: Rated for −40°C to 100°C operation, aligning with industrial temperature demands.
• Compact LBGA package: 256-LBGA (17×17) surface-mount package conserves PCB space while supporting the device’s pin count.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 10M50DAF256I7G?

The 10M50DAF256I7G positions itself as an industrial-grade FPGA option that balances large programmable logic capacity with substantial on-chip memory and a high I/O count. Its combination of 50,000 logic elements, 1,677,312 RAM bits, and 178 I/Os in a compact 256-LBGA package makes it suitable for designs that require integration of interface logic, buffering, and control functions.

Designed for industrial temperature ranges and RoHS-compliant manufacturing, this Intel MAX® 10 device offers a pragmatic choice for engineers seeking a robust, high-capacity programmable solution for embedded and industrial applications.

Request a quote or submit a purchase inquiry for the 10M50DAF256I7G to evaluate pricing and availability for your design needs.