10M50DAF256C7G

IC FPGA 178 I/O 256FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1677312 50000 256-LBGA

Quantity 1,234 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O178Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3125Number of Logic Elements/Cells50000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1677312

Overview of 10M50DAF256C7G – MAX® 10 Field Programmable Gate Array (FPGA), 50,000 logic elements, 256-LBGA

The 10M50DAF256C7G is an Intel MAX® 10 field programmable gate array (FPGA) offering 50,000 logic elements and 1,677,312 bits of on-chip RAM. Packaged for surface-mount applications in a 256-ball BGA footprint, this commercial-grade device is specified for single-supply core operation between 1.15 V and 1.25 V and an ambient operating range of 0 °C to 85 °C.

This device combines substantial programmable logic density with large on-chip memory and a wide complement of I/O to support complex logic, data buffering, and mid-density system integration where RoHS compliance and compact packaging are required.

Key Features

  • Logic Capacity — 50,000 logic elements to implement complex programmable logic and custom processing functions.
  • On‑Chip Memory — 1,677,312 total RAM bits for data buffering, lookup tables, and state storage without external memory.
  • I/O Count — 178 I/O pins to interface with peripherals, sensors, and other system components.
  • Power — Core supply range from 1.15 V to 1.25 V for standardized low-voltage integration into modern power architectures.
  • Package and Mounting — 256-ball LBGA package (supplier device package: 256-FBGA, 17×17) optimized for surface-mount assembly and compact board layouts.
  • Operating Range — Commercial temperature grade specified from 0 °C to 85 °C for mainstream electronics environments.
  • Compliance — RoHS compliant to meet environmental and regulatory requirements.

Unique Advantages

  • High logic density: 50,000 logic elements allow implementation of substantial digital functions on a single device, reducing the need for multiple discrete components.
  • Integrated memory resources: Over 1.6 Mb of on-chip RAM supports local buffering and state retention, simplifying board-level memory requirements.
  • Extensive I/O: 178 I/O pins provide flexible connectivity for complex system interfaces and peripheral integration.
  • Compact BGA footprint: 256-ball package with a 17×17 supplier footprint enables space-efficient designs and reliable surface-mount assembly.
  • Low-voltage core operation: 1.15–1.25 V supply compatibility helps align with contemporary power rails and low-power design practices.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic products.

Why Choose 10M50DAF256C7G?

The 10M50DAF256C7G delivers a balance of programmable logic capacity, substantial on-chip memory, and broad I/O in a compact 256-ball BGA package. Its specified voltage and temperature ranges, together with RoHS compliance, make it suitable for commercial electronics requiring high integration and reliable performance.

This device is a practical choice for designs that need significant logic and memory resources within a small footprint, while maintaining standard commercial operating conditions and lead-free assembly compatibility.

Request a quote or submit your procurement inquiry to receive pricing and availability for the 10M50DAF256C7G. Our team can provide lead-time information and support for your design planning needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up