10M50DAF256C6GES

The 10M50DAF256C6GES is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel that combines programmable logic, on-chip memory, and a high I/O count in a compact surface-mount package. It delivers 50,000 logic elements and 1,677,312 total RAM bits to support complex logic and data buffering requirements.

Designed for commercial-grade applications, the device is supplied in a 256-LBGA package (256-FBGA, 17×17), supports 178 I/Os, and operates from a 1.15 V to 1.25 V supply within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 50,000 logic elements provide programmable capacity for implementing custom logic, state machines, and data-path functions.
• Logic Blocks 3,125 CLBs (configurable logic blocks) enable structured implementation of combinational and sequential logic.
• On-Chip Memory 1,677,312 total RAM bits support buffering, FIFOs, and local data storage to reduce external memory dependency.
• I/O Count 178 I/Os allow direct interfacing to multiple peripherals and external devices.
• Power Voltage supply range of 1.15 V to 1.25 V for core power budgeting and predictable power envelope.
• Package & Mounting 256-LBGA (256-FBGA, 17×17) surface-mount package provides a compact footprint for high-density board designs.
• Operating Range & Grade Commercial grade operation from 0 °C to 85 °C for standard embedded and industrial environments.
• Environmental Compliance RoHS compliant to meet common regulatory requirements for electronic assemblies.

Unique Advantages

• Substantial programmable capacity: 50,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM count.
• Large on-chip memory: 1,677,312 RAM bits support data buffering and local storage, helping minimize or eliminate the need for external RAM in many designs.
• High I/O density: 178 I/Os provide flexibility to connect sensors, peripherals, and interface transceivers without adding external multiplexing hardware.
• Compact board-level integration: 256-LBGA (17×17 FBGA) surface-mount package saves PCB space while supporting high pin density.
• Predictable power window: Narrow core voltage range (1.15 V–1.25 V) simplifies power-supply selection and thermal planning.
• Commercial-temperature suitability: Rated 0 °C to 85 °C for deployments in typical commercial and many industrial-adjacent environments.

Why Choose 10M50DAF256C6GES?

The 10M50DAF256C6GES positions itself as a versatile MAX® 10 FPGA option for designers who require a balance of logic capacity, on-chip memory, and I/O density in a compact package. Its combination of 50,000 logic elements, over 1.6 million RAM bits, and 178 I/Os makes it suitable for consolidating multiple functions onto a single programmable device.

With a surface-mount 256-LBGA footprint and commercial temperature rating, this device fits board-level designs that need a high degree of integration while maintaining predictable power and thermal characteristics. It is a practical choice for engineering teams focused on reducing component count and streamlining design integration within the MAX® 10 product family.

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