10M50DAF672C6GES

The 10M50DAF672C6GES is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 672-ball BGA package. It combines a high logic element count with substantial on-chip RAM and a large I/O complement to address dense, I/O‑rich commercial designs.

Key attributes include 50,000 logic elements, 1,677,312 total RAM bits, up to 500 I/Os, a 672‑FBGA (27 × 27) surface‑mount package, and a 1.15 V–1.25 V core supply. The device is RoHS compliant and specified for commercial operation from 0 °C to 85 °C.

Key Features

• Logic Capacity — 50,000 logic elements to implement complex digital logic and custom datapaths.
• On‑Chip Memory — 1,677,312 total RAM bits for frame buffering, LUT RAM, and embedded data storage.
• I/O Density — Up to 500 I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 672‑FBGA (27 × 27) package in a surface‑mount format for compact board integration.
• Power Supply — Core voltage range of 1.15 V to 1.25 V for defined power planning and regulator selection.
• Operating Range — Commercial grade operation specified from 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant to support regulatory and manufacturing requirements.
• Documentation — Electrical characteristics, switching and configuration timing are documented in the Intel MAX 10 device datasheet for detailed system design.

Typical Applications

• Complex Logic Systems — Designs that require substantial logic capacity and embedded memory can leverage the 50,000 logic elements and 1,677,312 RAM bits for custom hardware acceleration and control implementations.
• I/O‑Intensive Interfaces — Applications needing many parallel or mixed‑signal interfaces benefit from the up to 500 available I/Os for sensors, peripherals, and high‑pin‑count connectors.
• Compact Board Designs — The 672‑FBGA (27 × 27) surface‑mount package enables dense PCB layouts where board space and routing density are constrained.
• Commercial‑Grade Embedded Systems — Systems operating within 0 °C to 85 °C can integrate this device where commercial temperature qualification is required.

Unique Advantages

• High Logic Density: 50,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial Embedded RAM: 1,677,312 RAM bits provide on‑chip data storage for buffering, FIFOs, and memory‑based logic without immediate external memory dependence.
• Large I/O Count: Up to 500 I/Os support complex interfacing needs and reduce the need for additional interface ICs.
• Compact BGA Package: The 672‑FBGA (27 × 27) surface‑mount package balances pin count with a compact footprint for space‑constrained designs.
• Commercial Temperature Specification: Rated for 0 °C to 85 °C operation to align with many commercial embedded product environments.
• Regulatory Compliance: RoHS compliance supports lead‑free manufacturing and environmental requirements.

Why Choose 10M50DAF672C6GES?

The 10M50DAF672C6GES positions itself as a high‑capacity, I/O‑dense MAX 10 FPGA option for commercial embedded designs that require significant logic resources and on‑chip RAM within a compact BGA package. Its defined core voltage range and documented electrical and configuration specifications in the Intel MAX 10 device datasheet enable precise power budgeting and timing analysis during system development.

This device is suited to engineering teams and procurement groups building commercial products that need a balance of logic density, memory, and peripheral connectivity while maintaining RoHS compliance and standard commercial temperature operation.

Request a quote or submit a pricing and availability inquiry to obtain lead times and volume pricing for the 10M50DAF672C6GES.