10M50DAF672C7G

The 10M50DAF672C7G is a MAX® 10 field programmable gate array from Intel, delivered in a 672-ball BGA package. It integrates up to 50,000 logic elements with 1,677,312 total RAM bits and supports up to 500 I/O pins, providing a compact, mid-range FPGA platform for commercial embedded designs.

Designed for surface-mount assembly and commercial-temperature operation (0 °C to 85 °C), this device operates from a 1.15 V to 1.25 V supply and is RoHS compliant.

Key Features

• Logic Capacity — Up to 50,000 logic elements suitable for complex combinational and sequential logic implementations.
• Embedded Memory — 1,677,312 total RAM bits to support on-chip buffering, FIFOs, and small-data-store requirements.
• I/O Density — Support for up to 500 I/O pins to enable high-pin-count interfaces and dense peripheral connectivity.
• Core Resources — 3,125 user logic clusters (CLBs) for flexible logic partitioning and resource allocation.
• Power — Low-voltage core operation with a supply range of 1.15 V to 1.25 V for power-efficient system integration.
• Package — 672-ball FBGA (27 × 27 mm) surface-mount package for space-efficient board layouts.
• Thermal and Grade — Commercial operating temperature from 0 °C to 85 °C, suitable for a wide range of non-industrial applications.
• Regulatory — RoHS compliant for environmentally conscious designs.

Typical Applications

• Embedded Processing and Control — Implements custom control logic and state machines where up to 50,000 logic elements and substantial on-chip RAM are required.
• Interfaces and Bridge Functions — Supports high-density I/O (up to 500 pins) for protocol bridging and multi-interface aggregation on a single device.
• Data Buffering and Packet Handling — Uses the 1,677,312 bits of embedded RAM for buffering, queuing, and small-scale packet/stream processing.

Unique Advantages

• High Logic Density: 50,000 logic elements enable complex designs without moving to larger, more expensive families.
• Substantial On‑Chip RAM: 1,677,312 total RAM bits reduce external memory requirements for many control and buffering tasks.
• Large I/O Count: Up to 500 I/O pins simplify board-level routing for multi-interface systems and reduce the need for external multiplexers.
• Compact, Surface‑Mount Package: 672-FBGA (27 × 27 mm) delivers high integration in a space-efficient footprint for dense PCBs.
• Low-Voltage Core Operation: 1.15 V–1.25 V supply helps optimize power consumption in battery- or regulator-constrained designs.
• RoHS Compliant: Meets environmental requirements for modern product development and supply chains.

Why Choose 10M50DAF672C7G?

The 10M50DAF672C7G positions itself as a mid-range MAX® 10 FPGA option that balances logic capacity, embedded memory, and I/O density in a compact 672-BGA package. Its combination of 50,000 logic elements, 1,677,312 RAM bits, and up to 500 I/Os is well suited to commercial embedded designs that require on-chip buffering, multiple interfaces, and moderate logic complexity.

Backed by Intel manufacturing, this device provides a scalable platform for developers and product teams seeking a commercially graded FPGA with RoHS compliance, surface-mount packaging, and defined operating voltage and temperature ranges for reliable deployment in commercial environments.

Request a quote or submit a product inquiry to obtain pricing, lead times, and availability for the 10M50DAF672C7G.