10M40SCE144A7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 101 1290240 40000 144-LQFP Exposed Pad |
|---|---|
| Quantity | 803 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 101 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2500 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1290240 |
Overview of 10M40SCE144A7G – MAX® 10 FPGA, 40,000 logic elements, 1,290,240 RAM bits, 101 I/O, 144-LQFP
The 10M40SCE144A7G is an Intel MAX® 10 field-programmable gate array (FPGA) device supplied in a 144-pin LQFP exposed-pad surface-mount package. It delivers a balance of programmable logic, on-chip RAM, and I/O count for designs that require configurable digital logic in automotive environments.
Designed for applications needing robust operating range and automotive qualification, this device integrates 40,000 logic elements and 1,290,240 total RAM bits while operating from a 2.85 V to 3.465 V supply and across –40°C to 125°C.
Key Features
- Core Logic 40,000 logic elements provide the programmable logic capacity for custom digital functions and signal processing.
- On‑chip Memory 1,290,240 total RAM bits available for FIFOs, buffers, and algorithm state storage.
- I/O Resources 101 user I/O pins support connection to peripherals, sensors, and vehicle networks.
- Power and Voltage Single supply operation in the 2.85 V to 3.465 V range for core and I/O power planning.
- Package and Mounting 144-LQFP exposed pad surface-mount package (supplier package: 144-EQFP, 20 × 20 mm) for PCB integration and thermal management.
- Automotive Qualification Automotive grade with AEC-Q100 qualification and specified operating temperature from –40°C to 125°C for in-vehicle deployment.
- RoHS Compliant Conforms to RoHS environmental requirements for lead-free assemblies.
Typical Applications
- Automotive control modules Programmable logic for domain controllers and vehicle subsystem control where AEC-Q100 qualification and wide temperature range are required.
- In-vehicle networking and gateway Implement protocol bridging, message routing, and I/O aggregation using available logic and I/O resources.
- Embedded signal processing On-chip RAM and logic elements support buffering and deterministic processing for sensor data and control loops.
Unique Advantages
- High logic density: 40,000 logic elements enable complex combinational and sequential designs without external programmable devices.
- Substantial on-chip RAM: 1,290,240 RAM bits reduce dependence on external memory for latency-sensitive buffering and data handling.
- Flexible I/O count: 101 I/O pins provide broad connectivity to sensors, actuators, and communication transceivers.
- Automotive-ready qualification: AEC-Q100 qualification and –40°C to 125°C operating range support deployment in automotive environments.
- Standard surface-mount package: 144-LQFP exposed-pad package (20 × 20 mm) simplifies PCB layout and thermal interfacing.
- RoHS compliant: Enables lead-free assembly processes and environmental compliance.
Why Choose 10M40SCE144A7G?
The 10M40SCE144A7G positions itself as a programmable, automotive‑qualified FPGA option that combines substantial logic capacity, on‑chip RAM, and a high I/O count in a compact 144‑pin exposed‑pad LQFP package. Its specified supply range and extended operating temperature make it suitable for electronic control modules and in-vehicle systems that require configurability and reliable operation across the automotive temperature window.
For design teams prioritizing integration and robustness, this device offers a concise set of verifiable specifications—logic resources, memory, I/O, package details, and AEC‑Q100 qualification—that simplify selection and enable predictable system-level planning.
Request a quote or submit a pricing and availability inquiry for the 10M40SCE144A7G to get tailored purchasing information and lead-time details.

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