10M40DDF672I7G

The 10M40DDF672I7G is an Intel MAX® 10 FPGA configured in a 672-ball BGA package, delivering 40,000 logic elements, 1,290,240 bits of on-chip RAM, and up to 500 user I/Os. It is specified as an industrial-grade device with an operating range from -40°C to 100°C and a core supply range of 1.15 V to 1.25 V.

This device is intended for designs that require substantial on-chip logic and memory resources combined with a high I/O count, packaged in a compact 672-FBGA (27×27) surface-mount format for space-constrained, industrial applications.

Key Features

• Core Logic  Provides 40,000 logic elements suitable for medium-to-high density logic implementations.
• On-chip Memory  Includes 1,290,240 total RAM bits to support data buffering, state machines, and local storage without external memory.
• High I/O Count  Up to 500 user I/Os for dense peripheral, sensor, and bus interfacing.
• Power  Core voltage supply specified between 1.15 V and 1.25 V to match system power-rail planning.
• Package & Mounting  Available in a 672-BGA / 672-FBGA (27×27) surface-mount package for high-pin-count, compact board layouts.
• Temperature Range  Industrial operating temperature from -40°C to 100°C for deployment in rugged environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use in control systems that require industrial temperature range and substantial on-chip logic and memory resources.
• High-density I/O Systems  Suitable for applications needing many external interfaces or parallel sensor connections thanks to up to 500 I/Os.
• Memory-rich Logic Designs  Appropriate for designs that combine significant logic with local RAM requirements, leveraging 1,290,240 bits of on-chip memory.

Unique Advantages

• High logic capacity: 40,000 logic elements enable implementation of complex finite-state machines, custom datapaths, and glue logic without external FPGA expansion.
• Substantial on-chip RAM: 1,290,240 bits of RAM reduce dependence on external memory for buffering and local data storage, simplifying BOM and board routing.
• Large I/O availability: Up to 500 user I/Os support dense peripheral integration and extensive signal interfacing on a single device.
• Industrial temperature rating: Specified -40°C to 100°C operation supports deployment in temperature-challenging environments.
• Compact, high-pin-count package: 672-FBGA (27×27) surface-mount package delivers high connectivity in a space-efficient footprint.
• RoHS compliant: Meets common environmental directives for modern manufacturing and assembly processes.

Why Choose 10M40DDF672I7G?

The 10M40DDF672I7G delivers a balanced combination of logic density, on-chip memory, and I/O capacity in a rugged industrial-rated package. Its 40,000 logic elements and 1,290,240 RAM bits make it well suited to designs that require significant local processing and buffering without relying on additional external components.

This part is a practical choice for engineers building space-conscious, high-I/O industrial systems that require predictable operating temperature and compliance with RoHS environmental standards. Its core voltage range and surface-mount 672-FBGA packaging support typical embedded system power and assembly flows.

If you would like pricing or availability, request a quote or submit an inquiry to purchase this Intel MAX® 10 FPGA part number 10M40DDF672I7G.