10M40DDF484C8G

The 10M40DDF484C8G is a MAX® 10 FPGA device from Intel delivering 40,000 logic elements and on-chip RAM suitable for commercial embedded designs. It combines significant logic capacity with 360 user I/Os and 1,290,240 bits of total RAM to address I/O‑dense and memory‑rich programmable logic requirements.

Packaged in a 484‑ball FBGA (23 × 23) surface‑mount package and specified for commercial operation (0 °C to 85 °C), this device is designed for applications that require integrated programmable logic, moderate on‑chip memory, and a compact BGA footprint.

Key Features

• Logic Capacity — 40,000 logic elements to implement complex custom logic and state machines.
• On‑chip RAM — 1,290,240 total RAM bits for buffering, FIFOs, and local data storage without external memory.
• General‑Purpose I/O — Up to 360 user I/O pins to support multiple peripherals, buses, and interfaces.
• Package — 484‑FBGA (23 × 23) surface‑mount package (484‑BGA) for compact system integration.
• Power — Core supply range of 1.15 V to 1.25 V to match system power rails and enable predictable power budgeting.
• Operating Range — Commercial grade with specified operating temperature from 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Commercial Embedded Systems — Programmable logic for controllers and embedded subsystems that operate within commercial temperature ranges.
• I/O‑Intensive Designs — Systems requiring many external interfaces can use the device’s 360 user I/Os for peripheral and bus connectivity.
• Memory‑Assisted Logic Functions — Designs that need on‑chip buffering, packet handling, or temporary data storage can leverage the 1,290,240 bits of RAM.

Unique Advantages

• High Logic Density: 40,000 logic elements provide the resources to implement substantial digital logic without external CPLDs or additional FPGAs.
• Significant On‑Chip Memory: Over 1.29 Mbits of internal RAM reduces dependence on external memory for many mid‑range designs.
• Extensive I/O Count: 360 user I/Os allow flexible interfacing to sensors, peripherals, and multiple buses in a single device.
• Compact BGA Package: 484‑FBGA (23 × 23) offers a dense, surface‑mount form factor for space‑constrained PCBs.
• Commercial Temperature Rating: Specified operation from 0 °C to 85 °C aligns with a wide range of commercial electronic products.
• Compliance Ready: RoHS compliance supports regulatory requirements for commercial device manufacturing.

Why Choose 10M40DDF484C8G?

The 10M40DDF484C8G offers a balanced combination of logic density, on‑chip memory, and I/O capacity in a compact 484‑FBGA package, making it well suited to commercial embedded designs that require substantial programmable logic and internal RAM. Its defined power envelope (1.15 V–1.25 V) and commercial temperature rating provide predictable integration into mainstream electronic products.

As a member of the Intel MAX® 10 family, this device is supported by family‑level documentation covering electrical characteristics, switching behavior, and configuration timing, enabling engineering teams to design and validate systems with confidence.

Request a quote or submit an inquiry to purchase the 10M40DDF484C8G and evaluate how its logic capacity, on‑chip RAM, and I/O resources can fit your next commercial embedded design.