10M40DDF484I7G

The 10M40DDF484I7G is an Intel MAX® 10 field programmable gate array (FPGA) in a 484-BGA package. It provides a balance of on-chip logic, memory and I/O suitable for industrial and embedded designs.

Key device attributes include 40,000 logic elements, 1,290,240 bits of total on-chip RAM, 360 user I/O, a 484-FBGA (23×23) surface-mount package, a 1.15–1.25 V supply range, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  Approximately 40,000 logic elements for implementing custom digital logic, state machines and glue logic on a single device.
• On‑chip Memory  1,290,240 bits of total RAM for buffering, FIFOs and small data storage without external memory.
• I/O Density  360 user I/O pins to support multiple peripherals, sensors and interface signals directly from the FPGA.
• Power Supply  Operates from a 1.15 V to 1.25 V core supply range to match modern low‑voltage power domains.
• Package & Mounting  484‑BGA (484‑FBGA, 23×23) surface‑mount package for high‑density board implementations.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance  RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Use the device for control logic, I/O aggregation and process interface elements that require industrial temperature operation.
• Embedded Processing and Glue Logic  Implement custom state machines, protocol bridging and peripheral control leveraging the available logic and on‑chip RAM.
• I/O Consolidation and Interface Bridging  Deploy the FPGA to consolidate multiple digital interfaces and reduce external components thanks to 360 I/O pins.
• Space‑constrained Board Designs  The 484‑BGA (23×23) surface‑mount package supports compact PCB layouts where board real estate is limited.

Unique Advantages

• High Logic Capacity: 40,000 logic elements enable substantial on‑chip integration and reduce the need for multiple discrete devices.
• Significant On‑chip RAM: 1,290,240 bits of RAM provide internal buffering and storage for many embedded tasks without external memory.
• Extensive I/O: 360 user I/O pins support broad connectivity to sensors, peripherals and external ICs from a single package.
• Industrial‑grade Operation: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact BGA Package: 484‑FBGA (23×23) surface‑mount package enables high‑density board designs and reliable soldered mounting.
• Low‑voltage Core: 1.15–1.25 V supply allows compatibility with modern low‑voltage power architectures.

Why Choose 10M40DDF484I7G?

10M40DDF484I7G combines a substantial logic element count, large on‑chip RAM and a high I/O count in a compact 484‑BGA package rated for industrial temperatures. This combination makes it suitable for engineers and procurement teams seeking a single FPGA solution that addresses integration, I/O density and environmental robustness.

The device’s specified voltage range, surface‑mount BGA package and RoHS compliance align with modern board design and manufacturing practices, offering a practical option for industrial and embedded applications where on‑board integration and operational reliability are priorities.

Request a quote or submit a quote today to obtain pricing and availability for 10M40DDF484I7G and to evaluate the device for your next industrial or embedded FPGA design.