10M40DCF672I7G

The 10M40DCF672I7G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) delivered in a 672‑ball BGA package for surface‑mount assembly. It combines a mid‑density programmable logic fabric with substantial on‑chip RAM and a large I/O count, packaged for industrial‑grade applications.

This device targets designs that require high I/O capacity, significant embedded memory, and robust operation across a wide temperature range while maintaining a compact BGA footprint.

Key Features

• Logic Capacity — 40,000 logic elements for implementing complex control, signal processing, and glue‑logic functions.
• Embedded Memory — 1,290,240 total RAM bits to support buffering, small data structures, and on‑chip storage.
• I/O Density — 500 I/O pins to connect multiple peripherals, sensors, and high‑pin‑count interfaces.
• Package and Mounting — 672‑BGA (supplier package: 672‑FBGA, 27×27 mm) in a surface‑mount form factor for compact board designs.
• Power Supply — Core supply range of 1.15 V to 1.25 V for integration with common FPGA power rails.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory — RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Use the industrial temperature rating and robust I/O to implement motor control, PLC interfacing, and factory automation logic.
• High‑Density I/O Aggregation — Consolidate multiple interface functions and protocol bridging where 500 I/Os are required.
• Embedded Memory‑Centric Designs — Leverage 1,290,240 bits of on‑chip RAM for buffering, FIFOs, and local data storage in real‑time systems.
• System Glue and Peripheral Management — Implement complex glue logic, bus arbitration, and peripheral controllers within a single programmable device.

Unique Advantages

• High Logic Density: 40,000 logic elements provide headroom for sizable custom logic implementations without external PLDs.
• Substantial On‑Chip RAM: Over 1.29 Mb of RAM reduces dependence on external memory for many control and buffering tasks.
• Extensive I/O Count: 500 I/Os simplify board routing and reduce the need for additional interface components.
• Industrial‑Grade Operation: −40 °C to 100 °C operating range supports deployment in demanding environments.
• Compact BGA Package: 672‑FBGA (27×27 mm) enables high‑density board layouts while maintaining thermal and mechanical stability.
• RoHS Compliant: Meets lead‑free manufacturing and environmental standards for modern production flows.

Why Choose 10M40DCF672I7G?

The 10M40DCF672I7G positions itself as a mid‑density, industrial‑grade programmable logic solution that balances sizeable logic capacity, abundant on‑chip memory, and very high I/O availability in a compact BGA package. Its voltage and thermal specifications make it suitable for engineers building robust embedded and industrial systems that require consolidate logic and memory on a single device.

Designed within the Intel MAX® 10 device family, this part is suitable for development teams and OEMs seeking a reliable, high‑I/O FPGA platform for connectivity, control, and integration tasks where board space and operating temperature range are critical considerations.

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