10M40DCF484I7G

The 10M40DCF484I7G is an Intel MAX® 10 field programmable gate array (FPGA) supplied in a 484-FBGA (23×23) surface-mount package. It delivers a balance of logic capacity, on-chip memory, and I/O density for industrial applications.

With 40,000 logic elements, 1,290,240 total RAM bits and up to 360 I/O, this device targets designs that require substantial programmable logic, significant embedded memory, and broad external connectivity while operating from a 1.15 V to 1.25 V core supply.

Key Features

• Logic Density  Provides 40,000 logic elements suitable for complex control, signal processing, and glue-logic implementations.
• On-chip Memory  Includes 1,290,240 total RAM bits to minimize dependence on external memory for data buffering and working storage.
• I/O Resources  Up to 360 I/O pins to support a wide range of interfaces and peripheral connections without extensive external multiplexing.
• Package & Mounting  484-FBGA (23×23) package in a surface-mount form factor for compact PCB integration.
• Power  Core supply operating range of 1.15 V to 1.25 V to align with standard FPGA power-rail designs.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, supporting the -I7 speed grade.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial-grade temperature rating and broad I/O count make the device suitable for factory automation, motor control interfaces, and industrial communication endpoints.
• I/O-intensive interface bridging  High pin count supports protocol bridging, sensor aggregation, and multi-bus interfacing without extensive external logic.
• Embedded systems with on-chip memory needs  Large on-chip RAM capacity provides local storage for buffering, lookup tables, or temporary data to streamline system architectures.
• Space-constrained PCB designs  484-FBGA surface-mount package enables dense board layouts where board area and component count are constrained.

Unique Advantages

• High logic capacity: 40,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing external component count.
• Substantial embedded RAM: 1,290,240 RAM bits reduce the need for external memory and simplify memory subsystem design.
• Extensive I/O: 360 available I/Os facilitate direct connectivity to peripherals, sensors, and buses, lowering the need for external multiplexers or expanders.
• Industrial reliability: Rated for −40 °C to 100 °C operation and specified as industrial grade for deployment in demanding environments.
• Compact surface-mount package: 484-FBGA (23×23) enables dense placement and modern PCB assembly processes.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 10M40DCF484I7G?

The 10M40DCF484I7G combines a high logic element count, substantial on-chip RAM, and a generous I/O complement in an industrial-grade, surface-mount FBGA package. It is positioned for designs that require dependable operation across −40 °C to 100 °C, a compact board footprint, and a balance of logic and memory resources.

This device is well suited to engineering teams seeking to consolidate functions, reduce external BOM complexity, and deliver robust systems in industrial and I/O-heavy applications while operating within a 1.15 V to 1.25 V core power envelope.

Request a quote or submit an inquiry for pricing and availability to begin evaluating the 10M40DCF484I7G for your next design.