10M40DCF484C7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 360 1290240 40000 484-BGA |
|---|---|
| Quantity | 147 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 360 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2500 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1290240 |
Overview of 10M40DCF484C7G – MAX® 10 FPGA, 40,000 logic elements, 484-BGA
The 10M40DCF484C7G is an Intel MAX® 10 field-programmable gate array (FPGA) offered in a 484-ball BGA package. It delivers 40,000 logic elements with 1,290,240 bits of on-chip RAM and 360 user I/O pins, making it suitable for dense, integration-focused FPGA designs.
This commercial-grade device operates from a 1.15 V to 1.25 V core supply and across a 0 °C to 85 °C ambient range, combining substantial logic and memory resources with a compact surface-mount 484-FBGA (23 × 23 mm) package for space-constrained applications.
Key Features
- Logic Resources 40,000 logic elements provide substantial programmable logic capacity for complex combinational and sequential functions.
- On-Chip Memory 1,290,240 total RAM bits of embedded memory for buffering, FIFOs, and LUT-based storage.
- I/O Density 360 user I/O pins support extensive external connectivity and high pin-count interfaces.
- Power Core voltage supply range of 1.15 V to 1.25 V enables predictable power planning for the FPGA core.
- Package & Mounting 484-FBGA (23 × 23 mm) surface-mount package (484-BGA case) for compact board layouts and high pin density.
- Grade & Speed Commercial grade device; the part number includes the -C7 commercial speed grade.
- Operating Range Rated for operation from 0 °C to 85 °C ambient temperature.
- Compliance RoHS compliant for environmental and manufacturing considerations.
Unique Advantages
- High logic and memory integration: Combines 40,000 logic elements with over 1.29 Mb of on-chip RAM to reduce external memory needs and simplify board-level design.
- Dense I/O count: 360 I/O pins enable direct connection to multiple peripherals and parallel interfaces without external muxing.
- Compact, surface-mount BGA: 484-FBGA (23 × 23 mm) package provides a high pin-count footprint in a space-efficient form factor.
- Predictable power envelope: Narrow core voltage range (1.15–1.25 V) assists in precise power-supply design and thermal planning.
- Commercial temperature rating: 0 °C to 85 °C operation aligned with standard commercial electronics deployments.
- RoHS compliance: Supports regulatory and manufacturing requirements for lead-free production.
Why Choose 10M40DCF484C7G?
The 10M40DCF484C7G balances substantial programmable logic and memory resources with a high I/O count in a compact 484-FBGA package. Its commercial-grade rating and defined core voltage range make it appropriate for a wide range of standard-temperature applications where integration and pin density are priorities.
Backed by Intel MAX 10 device documentation, this part is suited for designers who need a highly integrated FPGA solution with clear electrical and package specifications for efficient system design and procurement.
Request a quote or submit an inquiry for part number 10M40DCF484C7G to learn about availability and pricing.

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