10M40DCF256I6G

The 10M40DCF256I6G is an Intel MAX® 10 Field Programmable Gate Array in a 256-ball LBGA package, offered in an industrial grade. It integrates 40,000 logic elements and 1,290,240 bits of on-chip RAM to address designs that require substantial logic density and embedded memory.

With 178 user I/O and a low core voltage range of 1.15 V to 1.25 V, this surface-mount FPGA is sized for systems that need dense I/O connectivity, on-chip buffering, and operation across an extended temperature range of -40°C to 100°C.

Key Features

• Core Logic — 40,000 logic elements provide a high-density fabric for consolidating multiple logic functions on a single device.
• On-chip Memory — 1,290,240 bits of RAM enable local buffering, frame storage, and data manipulation without external memory.
• I/O Capacity — 178 user I/O pins support broad interfacing options for sensors, peripherals, and high-pin-count connectors.
• Power — Core supply range of 1.15 V to 1.25 V supports low-voltage operation and predictable power budgeting.
• Package & Mounting — 256-LBGA package (supplier package listed as 256-FBGA, 17×17) for compact surface-mount PCB implementations.
• Temperature Range — Industrial operating range from -40°C to 100°C for deployment in temperature-challenging environments.
• Compliance — RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• I/O-Intensive Control — Up to 178 I/O pins make the device suitable for designs that require extensive peripheral interfacing and control logic consolidation.
• Embedded Memory Acceleration — On-chip RAM supports buffering, packet handling, and local data storage to reduce external memory dependence.
• Industrial Automation — Industrial-grade temperature rating and surface-mount packaging make it appropriate for automation control and instrumentation systems that need reliable operation across wide temperatures.

Unique Advantages

• High Logic Density: 40,000 logic elements let you integrate multiple subsystems into a single FPGA, reducing bill-of-materials and board complexity.
• Significant On-Chip RAM: 1,290,240 bits of embedded RAM provide local storage for data buffering and intermediate processing without requiring external RAM.
• Generous I/O Count: 178 user I/Os enable flexible interfacing to peripherals, sensors, and high-pin-count connectors.
• Industrial Temperature Rating: Rated from -40°C to 100°C for dependable operation in demanding thermal environments.
• Compact Surface-Mount Packaging: 256-LBGA (supplier package 256-FBGA, 17×17) supports space-constrained PCB layouts while maintaining robust connectivity.
• Low-Voltage Core: 1.15 V to 1.25 V core supply range supports low-power design considerations and consistent power planning.

Why Choose 10M40DCF256I6G?

The 10M40DCF256I6G positions itself as a versatile, industrial-grade FPGA option for designs demanding a balance of high logic capacity, substantial on-chip RAM, and broad I/O. Its combination of 40,000 logic elements, 1,290,240 bits of RAM, and 178 I/Os enables system consolidation and reduces external component count.

Designed for surface-mount integration and rated for -40°C to 100°C operation, this MAX® 10 device provides a reliable platform for embedded and industrial applications where moderate-to-high logic density and embedded memory are required.

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