10M40DCF256C8G

IC FPGA 178 I/O 256FBGA
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 1290240 40000 256-LBGA

Quantity 1,690 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O178Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2500Number of Logic Elements/Cells40000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1290240

Overview of 10M40DCF256C8G – MAX® 10 Field Programmable Gate Array, 40,000 logic elements, 256-LBGA

The 10M40DCF256C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC. It provides on-chip programmable logic and memory resources in a compact surface-mount 256-LBGA package for commercial-grade applications.

With 40,000 logic elements, more than 1.29 Mbit of on-chip RAM and 178 I/O pins, this device is intended for designs that require substantial logic capacity, embedded memory and a high pin count within a standard commercial operating temperature range.

Key Features

  • Core Logic  40,000 logic elements deliver substantial programmable logic capacity for combinational and sequential logic implementations.
  • Logic Array Blocks  2,500 CLB/LAB equivalent blocks provide the fabric organization supporting the device's logic resources.
  • On-chip Memory  1,290,240 total RAM bits available for buffering, lookup tables and temporary storage.
  • I/O  178 general-purpose I/O pins support connectivity to external devices and subsystems.
  • Power  Supported core supply range is 1.15 V to 1.25 V for the device core.
  • Package & Mounting  256-LBGA package (supplier device package: 256-FBGA, 17 × 17) with surface-mount construction for compact PCB integration.
  • Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS-compliant.

Typical Applications

  • Commercial embedded systems  Use the FPGA to implement custom control logic, protocol handling and on-board processing within commercial-temperature designs.
  • Communications and interfacing  High I/O count supports protocol bridging, parallel/serial interfacing and glue logic in communication equipment designed for commercial use.
  • Prototyping and evaluation  The device’s sizable logic and memory resources make it suitable for proof-of-concept designs and feature verification in commercial projects.
  • Custom logic acceleration  Leverage on-chip RAM and logic resources to offload deterministic tasks or implement hardware accelerators inside commercial products.

Unique Advantages

  • High logic density: 40,000 logic elements enable substantial custom logic integration without immediate need for multiple devices.
  • Significant on-chip RAM: 1,290,240 bits of RAM provide local storage for buffering, LUTs and state data, reducing external memory dependence.
  • Extensive I/O capability: 178 I/O pins offer flexible connectivity for signals, buses and peripheral interfaces.
  • Compact, manufacturable package: 256-LBGA (256-FBGA, 17×17) in a surface-mount form factor supports dense PCB layouts and automated assembly.
  • Low-voltage core operation: 1.15 V–1.25 V supply range aligns with modern low-voltage system architectures.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for deployments in commercial environments.

Why Choose 10M40DCF256C8G?

The 10M40DCF256C8G balances substantial programmable logic capacity, on-chip memory and high I/O count in a compact 256-LBGA surface-mount package. Its commercial-grade thermal specification and RoHS compliance make it appropriate for a wide range of commercial electronic products that require integrated, programmable hardware logic.

This FPGA is well suited to designers and engineers who need to consolidate logic, memory and interfacing into a single device to simplify board design and reduce component count while maintaining deterministic, hardware-level control provided by an FPGA fabric.

Request a quote or submit a pricing inquiry to check availability and lead time for the 10M40DCF256C8G. Our team can provide pricing, lead-time information and ordering options to support your design and production needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up