10M40DAF672I6G

The 10M40DAF672I6G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA (27 × 27 mm) package. This industrial-grade FPGA provides a combination of logic capacity, on-chip RAM, and a high I/O count suited for embedded and industrial designs.

Key architectural attributes include 40,000 logic elements, 1,290,240 total RAM bits, and up to 500 I/O pins. The device supports a core voltage range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C, making it applicable where extended temperature operation and dense integration are required.

Key Features

• Logic Capacity  40,000 logic elements to implement complex digital functions and custom logic blocks.
• On‑chip Memory  1,290,240 total RAM bits for data buffering, FIFOs, and embedded memory needs within the FPGA fabric.
• High I/O Count  Up to 500 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting  672-ball FBG A package (27 × 27 mm), surface-mount mount style for compact high-density board designs.
• Industrial Grade Temperature  Specified operating range from −40 °C to 100 °C for use in industrial environments.
• Supply Voltage  Core supply requirement from 1.15 V to 1.25 V for power planning and regulator selection.
• RoHS Compliant  Manufactured to meet RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control  Use the industrial temperature rating and high I/O count for control logic, sensor interfacing, and machine I/O aggregation.
• High‑I/O Interface Systems  Leverage up to 500 I/Os and the 672-BGA package for dense interface and protocol bridging designs.
• Memory‑Intensive Logic  Deploy the 1,290,240 bits of on-chip RAM together with 40,000 logic elements for buffering, packet handling, or data-stream processing.
• Embedded System Integration  Integrate custom logic and peripheral functions into a single device footprint for compact embedded applications.

Unique Advantages

• High Logic Density: 40,000 logic elements provide headroom for complex finite-state machines, custom processors, and glue logic without external ASICs.
• Substantial On‑Chip RAM: 1,290,240 total RAM bits reduce dependence on external memory for many buffering and data‑path applications.
• Extensive I/O Capability: Up to 500 I/Os support multiple parallel interfaces and diverse peripheral connections from a single FPGA.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployments in temperature-challenging environments.
• Compact BGA Package: 672-FBGA (27 × 27 mm) enables high-density board layouts while supporting surface-mount assembly.
• Defined Supply Range: 1.15 V to 1.25 V core voltage simplifies power-supply design and thermal planning for the FPGA core.

Why Choose 10M40DAF672I6G?

The 10M40DAF672I6G positions itself as an industrial-grade FPGA option that combines a large logic fabric, substantial on-chip RAM, and a very high I/O count in a compact 672-BGA package. These attributes make it well suited to designs that require integration of complex logic and wide interfacing while operating across an extended temperature range.

For engineering teams focused on integration density, predictable power requirements (1.15–1.25 V), and industrial temperature performance, this MAX® 10 device delivers a verifiable mix of resources and package options consistent with embedded and industrial applications.

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