10M40DAF484I6G

The 10M40DAF484I6G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package. It delivers a combination of programmable logic, on-chip RAM, and a high I/O count intended for industrial-grade embedded applications.

With 40,000 logic elements, 1,290,240 total RAM bits and up to 360 I/O, this device supports complex logic integration and dense interfacing while operating across an industrial temperature range and a narrow core voltage supply window.

Key Features

• Core Logic  40,000 logic elements provide the programmable fabric for custom logic, state machines, and glue-logic integration.
• On‑Chip Memory  1,290,240 total RAM bits available for buffering, FIFOs, and on‑chip data storage.
• I/O Capacity  Up to 360 I/O pins to support wide external connectivity and multiple peripheral interfaces.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match target system power rails and power sequencing requirements.
• Package and Mounting  484-BGA package (supplier device package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact board layouts.
• Temperature and Grade  Industrial grade operation with an ambient temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant, supporting environmental and manufacturing regulations.

Typical Applications

• Industrial Control and Automation  Use the device’s industrial temperature rating, high I/O count and substantial on‑chip memory for control logic, I/O aggregation, and real‑time processing in factory or process automation systems.
• Communications and Networking  Its combination of logic density and plentiful I/O supports protocol handling, packet processing, and interface bridging in networking equipment.
• Embedded Systems and Prototyping  High logic capacity and RAM make this FPGA suitable for complex embedded designs, hardware acceleration, and rapid prototyping of custom digital functions.
• Test and Measurement  Deterministic programmable logic and extensive I/O enable custom timing, data capture, and signal conditioning roles in instrumentation hardware.

Unique Advantages

• High Integration Density: 40,000 logic elements combined with 1,290,240 RAM bits reduce the need for external glue logic and memory, simplifying system BOM.
• Extensive External Connectivity: Up to 360 I/O pins support broad interfacing to sensors, transceivers, and peripherals without multiple external expanders.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and labeled industrial grade to meet environmental demands typical of industrial deployments.
• Compact Surface-Mount Package: The 484-BGA (484-FBGA, 23 × 23) package enables a compact PCB footprint while providing high pin density for complex designs.
• Regulatory-Friendly: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose 10M40DAF484I6G?

The 10M40DAF484I6G positions itself as a robust, industrial-grade FPGA option for designs that require substantial programmable logic, on-chip memory, and a high I/O count in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for long-term deployment in industrial environments.

This device is well suited to engineers and teams building industrial controllers, communications equipment, embedded systems, and test instruments who need a balance of integration, I/O capability, and thermal tolerance without adding external logic or memory components.

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