10M40DAF256I7G

The 10M40DAF256I7G is a MAX® 10 field programmable gate array (FPGA) from Intel, delivered in a 256-ball LBGA package. It provides a programmable logic platform with 40,000 logic elements and 1,290,240 total RAM bits for designs that require on-chip logic density and embedded memory.

Designed for industrial-grade operation, this device offers a 178-pin I/O complement, surface-mount packaging, a 1.15 V to 1.25 V supply range and an operating temperature range of −40 °C to 100 °C, making it suitable for systems that require robust temperature performance and high integration.

Key Features

• Core / Logic  40,000 logic elements provide substantial programmable logic capacity for complex digital functions and custom logic integration.
• Memory  1,290,240 total RAM bits of on-chip memory to support buffering, FIFOs, and state storage without external memory.
• I/O  178 user I/O pins for interfacing with peripherals, sensors, and external devices.
• Package & Mounting  Supplied in a 256-LBGA package (supplier device package listed as 256-FBGA, 17×17) and intended for surface-mount assembly.
• Power  Operates from a 1.15 V to 1.25 V supply, enabling integration into low-voltage system power rails.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

• High logic capacity: 40,000 logic elements enable implementation of substantial custom logic and parallel processing blocks on-chip.
• Significant embedded memory: 1,290,240 RAM bits reduce dependency on external memory, simplifying board-level design and lowering BOM count.
• Generous I/O count: 178 I/O pins provide flexibility for multi-channel interfaces and mixed-signal connectivity needs.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in environments with wide temperature variation.
• Compact surface-mount package: 256-ball LBGA footprint enables high-density board layouts while maintaining a large I/O complement.
• RoHS compliant manufacturing: Conforms to lead-free assembly requirements for modern electronics production.

Why Choose 10M40DAF256I7G?

The 10M40DAF256I7G delivers a balance of logic capacity, embedded memory, and I/O resources in a compact, industrial-grade FPGA package from Intel. Its combination of 40,000 logic elements, over 1.29M bits of on-chip RAM and 178 I/Os makes it a solid choice for systems that need high integration, robust temperature performance, and minimized external components.

This device is appropriate for engineers and teams developing industrial and embedded designs that demand on-chip memory and significant programmable logic within a surface-mount 256-ball LBGA footprint. Its voltage and thermal specifications support integration into low-voltage, wide-temperature-range applications.

Request a quote or submit an inquiry today to evaluate 10M40DAF256I7G for your next design and obtain pricing and availability details.