10M40DAF256I6G

The 10M40DAF256I6G is an Intel MAX® 10 field programmable gate array (FPGA) device providing a balanced combination of programmable logic, on-chip RAM, and I/O density in a compact surface-mount package. This device targets designs that require up to 40,000 logic elements, 1,290,240 bits of embedded RAM, and 178 general-purpose I/Os while operating across an industrial temperature range.

Architected as a MAX® 10 FPGA, the 10M40DAF256I6G delivers integrated resources and power characteristics suitable for industrial-grade embedded systems that need programmable logic density, substantial on-chip memory, and a high pin count in a 256-ball BGA footprint.

Key Features

• Logic Capacity  40,000 logic elements provide the programmable fabric for implementing custom logic, state machines, and data-paths.
• On-chip Memory  1,290,240 total RAM bits for buffering, FIFOs, and small embedded data storage without mandatory external memory.
• I/O Count  178 user I/Os to support extensive peripheral interfacing and signal routing on the host board.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to match standard low-voltage power rails for FPGA core operation.
• Package and Mounting  256-LBGA package (supplier device package: 256-FBGA, 17×17) with surface-mount construction for compact PCB integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet environmental demands in industrial applications.
• Regulatory Compliance  RoHS compliant material status for regulatory and manufacturing conformity.
• Device Family  Part of the Intel MAX® 10 FPGA family, with device-level electrical and configuration specifications defined in the Intel MAX 10 FPGA device documentation.

Unique Advantages

• High logic density in a compact package: 40,000 logic elements delivered in a 256-ball BGA helps conserve PCB area while enabling complex logic integration.
• Substantial on-chip RAM: 1,290,240 bits of embedded RAM reduce the need for external memory for many buffering and data-path tasks, simplifying BOM and board layout.
• Extensive I/O capability: 178 I/Os provide flexibility for connecting multiple peripherals, buses, and mixed-signal interfaces without immediate external expanders.
• Industrial-grade operation: −40 °C to 100 °C rating and industrial grade classification support deployments in temperature-challenging environments.
• Low-voltage core: 1.15–1.25 V supply range aligns with modern low-voltage power architectures for efficient core power delivery.
• RoHS compliant: Meets RoHS material requirements for environmentally driven manufacturing and assembly processes.

Why Choose 10M40DAF256I6G?

The 10M40DAF256I6G combines a substantial count of logic elements and embedded RAM with a high I/O count and an industrial temperature rating, making it a practical choice for embedded designs that require programmable logic density and on-chip storage in a compact surface-mount BGA package. Its voltage and packaging characteristics facilitate integration into modern low-voltage, space-constrained PCBs.

Engineers and procurement teams seeking an Intel MAX® 10 FPGA with clear, verifiable specifications for logic capacity, memory, I/O, temperature range, and packaging can evaluate the 10M40DAF256I6G for applications where these parameters align with system requirements. The device’s documented electrical and configuration specifications provide the technical foundation for design and validation.

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