10M40DAF484C8G

The 10M40DAF484C8G is an Intel MAX® 10 field programmable gate array provided in a 484-FBGA (23×23) surface-mount package. It integrates 40,000 logic elements, 1,290,240 bits of on-chip RAM and up to 360 I/O pins, delivering a compact, high-density programmable logic solution for commercial applications.

Designed for systems that require substantial programmable logic density, embedded RAM and broad I/O capability within a single 484-BGA package, the device operates from a 1.15 V to 1.25 V core supply and across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Provides 40,000 logic elements to implement complex custom logic, state machines and datapath designs.
• Embedded Memory  Includes 1,290,240 total RAM bits for on-chip data buffering, FIFOs and memory-mapped storage.
• I/O Capability  Up to 360 I/O pins allow extensive external interfacing for parallel buses, control signals and peripheral connectivity.
• Package  Supplied in a 484-FBGA (23×23) surface-mount package (484-BGA case) to support compact board layouts and dense routing.
• Power  Core voltage range of 1.15 V to 1.25 V for integration into regulated power architectures.
• Commercial Grade  Rated for operation from 0 °C to 85 °C and classified as a commercial-grade component.
• Regulatory  RoHS compliant for environmental and assembly process considerations.

Typical Applications

• Custom Logic Accelerators  Use the 40,000 logic elements and on-chip RAM to implement application-specific datapaths and hardware accelerators within commercial systems.
• I/O-Intensive Interfaces  Leverage up to 360 I/Os to consolidate peripheral interfaces, expand bus connectivity and manage multi-channel signals on a single device.
• Embedded Control and Signal Processing  Combine logic density and embedded RAM to implement control algorithms, protocol handling and intermediate buffering in embedded products operating within the commercial temperature range.

Unique Advantages

• High Logic Density: 40,000 logic elements provide the capacity to implement large custom logic designs without external logic expansion.
• Substantial On-Chip Memory: 1,290,240 bits of RAM reduce dependency on external memory for many buffering and storage tasks, simplifying board design.
• Extensive I/O Count: Up to 360 I/Os enable broad peripheral connectivity and flexible pin assignments for multi-interface systems.
• Compact Packaging: The 484-FBGA (23×23) package offers a high pin count in a compact form factor suitable for space-constrained PCBs.
• Commercial Temperature Support: Rated 0 °C to 85 °C to match a wide range of commercial electronic products and environments.
• RoHS Compliance: Environmentally compliant materials support modern assembly and end-product requirements.

Why Choose 10M40DAF484C8G?

The 10M40DAF484C8G positions itself as a high-density, commercially graded FPGA option that brings together large logic capacity, significant on-chip RAM and a high I/O count in a 484-FBGA package. Its electrical and thermal ratings make it suitable for commercial designs that demand integrated programmable logic, compact board footprint and extensive connectivity.

This device is well suited for design teams and OEMs building advanced control, interface and processing functions where on-chip resources and a high pin count reduce BOM complexity and simplify system integration.

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