10M40DAF672C7G

The 10M40DAF672C7G is a MAX® 10 Field Programmable Gate Array (FPGA) from Intel provided in a 672-ball BGA package. It delivers a mid-range logic density with 40,000 logic elements and on-chip RAM totaling 1,290,240 bits, combined with up to 500 I/O pins for flexible system integration.

Designed for commercial applications, this surface-mount FPGA operates from a 1.15 V to 1.25 V supply and across an operating temperature range of 0 °C to 85 °C, offering a balance of integration and performance for embedded and communication-focused designs.

Key Features

• Core Logic 40,000 logic elements provide programmable logic capacity for mid-range FPGA designs.
• On-Chip Memory 1,290,240 total RAM bits available for buffering, state storage, and small memory structures.
• I/O Density Up to 500 I/O pins support extensive peripheral and bus interfacing options.
• Power and Voltage Operates from a defined supply range of 1.15 V to 1.25 V, enabling predictable power design and supply selection.
• Package and Mounting 672-ball FBGA (672-FBGA, 27×27) surface-mount package provides a compact footprint for board-level integration.
• Temperature Range Rated for commercial operation from 0 °C to 85 °C to match typical commercial product environments.
• Compliance RoHS compliant, supporting lead-free manufacturing processes and regulatory requirements for many commercial products.

Typical Applications

• Commercial Embedded Systems — Use the FPGA's logic density and on-chip RAM to implement custom control, interfacing, and data handling functions in commercial devices.
• Networking & Communications — High I/O count and on-chip memory support protocol handling, packet buffering, and interface bridging in communication equipment.
• Consumer Electronics — Compact 672-BGA package and surface-mount mounting support integration into space-constrained consumer devices requiring programmable logic.
• Prototyping & Development — Programmable logic capacity and abundant I/O make this device suitable for validating designs and building development platforms.

Unique Advantages

• Substantial Logic Capacity: 40,000 logic elements enable implementation of complex control and signal-processing functions without external ASICs.
• Significant On-Chip RAM: 1,290,240 RAM bits reduce the need for external memory in many buffering and state-storage applications.
• High I/O Count: Up to 500 I/Os support dense peripheral connectivity and multi-protocol interfacing on a single device.
• Compact BGA Footprint: 672-FBGA (27×27) package enables high-density board layouts while maintaining manufacturability for surface-mount assembly.
• Defined Supply Window: Narrow 1.15 V to 1.25 V supply range simplifies power budgeting and regulator selection.
• Commercial Temperature Rating: Qualified for 0 °C to 85 °C operation to match typical commercial product environments.

Why Choose 10M40DAF672C7G?

The 10M40DAF672C7G positions itself as a mid-range, commercial-grade FPGA solution that combines ample logic resources, substantial on-chip RAM, and a high I/O count in a compact 672-BGA package. It is well suited for designers seeking programmable flexibility and integration for embedded, communication, and consumer product applications.

Backed by Intel's MAX® 10 family, this device offers predictable supply requirements, commercial-temperature operation, and RoHS compliance—providing a practical balance of integration and manufacturability for projects that require scalable programmable logic without over-specification.

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