10M40DAF672I7G

The 10M40DAF672I7G is a MAX® 10 field programmable gate array (FPGA) IC designed for industrial-grade embedded applications. It provides a combination of logic capacity, embedded RAM, and a high-count I/O footprint in a 672-ball BGA package for dense system integration.

Typical use cases include industrial control and automation, high-density I/O bridging, and logic designs that require on-chip RAM and robust operating temperature capability. The device’s specified logic, memory, and I/O resources enable compact, single-chip implementations of complex digital functions.

Key Features

• Core Logic 40,000 logic elements available for implementing custom digital functions, state machines, and control logic.
• Embedded Memory 1,290,240 total RAM bits to support buffering, packet handling, and on-chip data storage without external memory.
• I/O Density Up to 500 I/O pins to support extensive peripheral interfacing, multi-channel sensor connectivity, and high-pin-count designs.
• Package & Mounting 672-ball BGA (672-FBGA, 27×27) surface-mount package for compact board-level integration and reliable soldered connections.
• Power Operates from a core supply in the range of 1.15 V to 1.25 V, enabling defined power budgeting for the core domain.
• Temperature Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C suitable for demanding environmental conditions.
• Compliance RoHS compliant for regulatory alignment with common environmental requirements.

Typical Applications

• Industrial Control — Implements machine control, programmable logic, and I/O aggregation where industrial temperature range and robust mounting are required.
• High-Density I/O Bridging — Provides up to 500 I/Os for protocol bridging, board-level interface concentration, and multi-sensor networks.
• Memory-Intensive Logic — Uses 1,290,240 RAM bits for data buffering, FIFO implementations, and packet or frame processing without external RAM.
• Embedded System Integration — Consolidates multiple logic functions into a single 672-BGA device to reduce component count and PCB area.

Unique Advantages

• High logic capacity: 40,000 logic elements enable integration of complex control and signal-processing functions on-chip.
• Substantial on-chip RAM: 1.29 Mbit of embedded RAM reduces or eliminates the need for external memory in many buffering and processing tasks.
• Large I/O count: Up to 500 I/Os support connectivity to numerous peripherals and sensors without additional interface chips.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh environments and factory-floor applications.
• Compact BGA package: 672-FBGA (27×27) provides high pin density in a space-efficient footprint for board-level miniaturization.
• RoHS compliant: Meets common environmental compliance requirements for modern electronic products.

Why Choose 10M40DAF672I7G?

The 10M40DAF672I7G targets designs that require a balance of logic density, embedded memory, and extensive I/O in an industrial-grade FPGA package. Its combination of 40,000 logic elements, 1,290,240 RAM bits, and up to 500 I/Os makes it suitable for consolidating multiple functions into a single, compact device while meeting −40 °C to 100 °C operating requirements.

For engineers seeking a single-chip solution to reduce BOM complexity and preserve board space, this MAX® 10 FPGA offers a verifiable specification set for predictable power, thermal, and I/O planning in industrial and embedded systems.

Request a quote or submit a purchasing inquiry for the 10M40DAF672I7G to get pricing and availability details specific to your project needs.