10M40DAF672C8G

The 10M40DAF672C8G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) IC designed for commercial electronic designs that require on-chip reconfigurable logic. The device provides a combination of logic, embedded RAM, and extensive I/O in a 672-ball BGA package for surface-mount assembly.

Key Features

• FPGA Core — MAX® 10 family field programmable gate array architecture implemented with 40,000 logic elements and 2,500 LABs.
• On‑chip Memory — 1,290,240 total RAM bits for embedded data storage and buffering directly within the FPGA fabric.
• I/O Density — 500 available I/O pins to support a wide range of external interfaces and parallel connectivity.
• Power — Operates from a core voltage supply range of 1.15 V to 1.25 V, enabling compatibility with standard low-voltage FPGA power domains.
• Package & Mounting — 672-ball BGA package (supplier package: 672-FBGA, 27×27 mm) configured for surface-mount PCB assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — On-board reconfigurable logic and embedded RAM enable custom control and signal processing functions within commercial equipment.
• High‑I/O Interface Design — The 500 I/O pins support dense peripheral connectivity and parallel bus implementations in systems requiring many external interfaces.
• Compact Board-Level Integration — The 672-BGA surface-mount package provides a high-density solution for compact PCB layouts where integrated logic and memory reduce external component count.

Unique Advantages

• Substantial Logic Capacity: 40,000 logic elements provide ample programmable fabric for medium-complexity designs without external logic ICs.
• Integrated RAM Resources: 1,290,240 total RAM bits reduce dependency on external memory for data buffering and small lookup tables.
• High Pin Count: 500 I/Os enable flexible interface options and parallel connectivity to peripherals and sensors.
• Compact, Surface-Mount Package: 672-FBGA (27×27) packaging offers a dense, manufacturable footprint for modern PCB assemblies.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial product requirements.
• RoHS Compliant: Meets lead-free manufacturing requirements for commercial production environments.

Why Choose 10M40DAF672C8G?

The 10M40DAF672C8G delivers a balanced combination of programmable logic, embedded RAM, and extensive I/O in a single commercial-grade package. Its 40,000 logic elements and over 1.29 million RAM bits provide the resources needed for custom control, data buffering, and interface logic while the 672-ball BGA enables compact board integration.

This device is suited to teams and designs that require a reconfigurable, high‑I/O solution for commercial electronic products and prototypes. Its specifications support scalable designs where on-chip memory and plentiful I/O help reduce external components and simplify system architecture.

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