10M40DAF484I7G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 360 1290240 40000 484-BGA |
|---|---|
| Quantity | 156 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 360 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2500 | Number of Logic Elements/Cells | 40000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1290240 |
Overview of 10M40DAF484I7G – MAX® 10 Field Programmable Gate Array (FPGA) IC 360 1290240 40000 484-BGA
The 10M40DAF484I7G is an Intel MAX® 10 FPGA offered in a compact 484-ball BGA package. It integrates a high-density programmable logic fabric with on-chip RAM and a large complement of I/O to address designs that require significant logic capacity and memory bandwidth within an industrial temperature range.
Built for surface-mount assembly and RoHS-compliant production, this industrial-grade device provides predictable operating conditions with a core supply range of 1.15 V to 1.25 V and an operating temperature span from −40 °C to 100 °C.
Key Features
- Programmable Logic Provides 40,000 logic elements to implement complex digital functions and custom hardware acceleration.
- On-chip Memory Includes 1,290,240 bits of total RAM for buffering, packet processing, and temporary storage without external RAM.
- I/O Density 360 user I/O pins support high pin-count interfaces and multi-channel connectivity in a single device.
- Package & Mounting 484-BGA (supplier package: 484-FBGA, 23 × 23 mm) in a surface-mount footprint for space-efficient board integration.
- Power Supply Core voltage supply range of 1.15 V to 1.25 V for defined power and timing behavior.
- Temperature & Grade Industrial grade with an operating range of −40 °C to 100 °C for robust deployment in temperature-challenging environments.
- Environmental Compliance RoHS-compliant to support regulatory requirements for lead-free manufacturing.
Typical Applications
- Industrial Control Systems Industrial-grade temperature rating and high logic density make this FPGA suitable for control, sequencing, and real-time processing tasks in factory automation and machine control.
- I/O-Intensive Interfaces With 360 I/O pins, the device is well suited for designs requiring multiple parallel interfaces, sensor arrays, or multi-channel data acquisition.
- Embedded Acceleration Large on-chip RAM and 40,000 logic elements enable local buffering and hardware acceleration for embedded signal processing and protocol offload.
Unique Advantages
- High Logic Capacity: 40,000 logic elements provide ample resources for implementing complex state machines, datapaths, and custom logic without partitioning across multiple devices.
- Substantial On-Chip RAM: 1,290,240 bits of RAM reduce dependency on external memory for many buffering and storage needs, simplifying board design and lowering BOM cost.
- Generous I/O Count: 360 I/Os enable direct connectivity to a wide range of peripherals and parallel interfaces, reducing the need for external multiplexing or expanders.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in harsh or variable-temperature environments common in industrial applications.
- Compact BGA Package: 484-FBGA (23 × 23 mm) balances high pin count with a small PCB footprint for space-constrained systems.
- RoHS Compliance: Facilitates lead-free assembly and supports regulatory and customer environmental requirements.
Why Choose 10M40DAF484I7G?
The 10M40DAF484I7G positions itself as a high-capacity, industrial-grade programmable device that consolidates logic, memory, and extensive I/O in a compact surface-mount package. Its combination of 40,000 logic elements, over 1.29 Mbits of on-chip RAM, and 360 I/Os addresses designs that demand local processing, interface density, and reliable operation across a wide temperature range.
This device is suited to engineers and teams designing industrial control, embedded acceleration, and I/O-heavy systems who need a single-device solution to reduce system complexity, save board space, and simplify supply-chain considerations while maintaining predictable electrical and thermal characteristics.
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