10M40DAF484C7G

The 10M40DAF484C7G is an Intel MAX® 10 FPGA device offering programmable logic resources and embedded RAM in a compact 484‑BGA package. It delivers 40,000 logic elements and 1,290,240 bits of on‑chip RAM, combined with 360 device I/O to address demanding programmable-logic designs.

Manufactured as a commercial‑grade device (temperature range 0 °C to 85 °C) and requiring a supply voltage of 1.15 V to 1.25 V, this part is suited for applications that need significant logic capacity, substantial on‑chip memory, and high I/O density.

Key Features

• Core Logic  40,000 logic elements provide programmable fabric for implementing complex digital logic and user IP.
• On‑chip Memory  Total RAM capacity of 1,290,240 bits supports buffering, FIFOs, and state storage without external memory.
• I/O Density  360 I/O pins enable high‑pin‑count interfacing to peripherals, controllers, and external devices.
• Power Supply  Operates from a core voltage supply range of 1.15 V to 1.25 V, consistent with MAX 10 device requirements.
• Package & Mounting  484‑BGA (supplier: 484‑FBGA, 23 × 23) surface‑mount package for compact, high‑density board designs.
• Temperature & Grade  Commercial grade with an operating range of 0 °C to 85 °C and designated speed grade -C7 as supported by the MAX 10 datasheet.
• Regulatory  RoHS compliant.

Typical Applications

• Custom Logic and Prototyping  Implement and iterate custom digital logic and IP within a reprogrammable FPGA fabric using 40,000 logic elements.
• High‑Density I/O Systems  Leverage 360 I/O pins for interfacing to multiple peripherals, sensors, or parallel buses without external expander chips.
• Memory‑Centric Control  Use the 1,290,240 bits of on‑chip RAM for buffering, packet processing, or state machines that require local, fast memory.

Unique Advantages

• Substantial Logic Capacity: 40,000 logic elements allow implementation of sizeable designs without immediate need for larger FPGA families.
• Integrated Memory Resource: Over 1.29 Mbits of on‑chip RAM reduces dependency on external memory, simplifying BOM and board layout.
• High I/O Count: 360 I/O pins accommodate complex interfacing scenarios while keeping board real estate efficient.
• Compact BGA Package: 484‑BGA (484‑FBGA, 23×23) enables high‑density PCB designs in a surface‑mount form factor.
• Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic product deployment.

Why Choose 10M40DAF484C7G?

The 10M40DAF484C7G combines a sizable logic fabric, significant on‑chip RAM, and a high I/O count in a compact 484‑BGA package, offering a balanced solution for designs that require integrated memory and dense connectivity. Its commercial grade and defined supply voltage range make it appropriate for a wide range of programmable logic applications that need deterministic electrical characteristics and on‑chip resources.

Designed as part of the Intel MAX® 10 family, this device is suitable for engineers seeking an FPGA with notable on‑chip memory and I/O capacity while maintaining a surface‑mount, board‑friendly package and RoHS compliance.

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