10M40DAF256C7G

The 10M40DAF256C7G is an Intel MAX® 10 FPGA offered in a 256‑ball BGA package. It provides a programmable logic fabric with 40,000 logic elements, on‑chip RAM totaling 1,290,240 bits, and a 178‑pin I/O count for mid‑density embedded designs.

Designed for commercial‑grade applications, the device operates from a 1.15 V to 1.25 V core supply and across an operating temperature range of 0 °C to 85 °C. The device datasheet documents configuration, timing and system‑management features such as JTAG timing, remote system upgrade circuitry, user watchdog timings, and programmable I/O delays.

Key Features

• Core Logic — 40,000 logic elements provide substantial programmable logic capacity for mid‑range FPGA designs.
• On‑Chip Memory — 1,290,240 total RAM bits available for data buffering, state storage, and intermediate processing.
• I/O Density — 178 I/O pins support a broad set of external interfaces and signal connections.
• Power — Core voltage supply range of 1.15 V to 1.25 V for defined power and timing conditions.
• Package & Mounting — 256‑LBGA package (supplier device package: 256‑FBGA, 17×17) with surface‑mount assembly suitability.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Configuration & System Management — Device documentation covers configuration specifications, JTAG timing parameters, remote system upgrade circuitry timing, user watchdog internal circuitry timing, and programmable I/O delays.
• Regulatory Compliance — RoHS‑compliant manufacturing status.

Unique Advantages

• Substantial Logic Capacity: 40,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing external component count.
• Generous On‑Chip RAM: 1,290,240 bits of RAM support data buffering and local storage without relying on external memory.
• Broad I/O Availability: 178 I/O pins provide flexibility for interfacing with sensors, controllers, and peripherals.
• Compact BGA Packaging: 256‑ball BGA (17×17) minimizes PCB area while allowing high pin density for complex designs.
• Documented Configuration & Timing: Comprehensive datasheet coverage of configuration, JTAG, remote upgrade, watchdog, and programmable I/O delays helps streamline system integration and validation.
• Commercial Grade Reliability: Rated for 0 °C to 85 °C operation to match standard commercial electronics environments.

Why Choose 10M40DAF256C7G?

The 10M40DAF256C7G positions itself as a mid‑density MAX® 10 FPGA option that balances programmable logic capacity, on‑chip RAM, and I/O resources in a compact BGA package. Its documented configuration and timing features make it a practical choice for designers who need verified behavior for system management functions like JTAG and remote upgrades.

With RoHS compliance and defined core voltage and temperature ranges, this commercial‑grade device provides a clear, specification‑driven choice for embedded design projects requiring a programmable logic solution with integrated memory and flexible I/O.

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