10M25SCE144A7G

The 10M25SCE144A7G is a MAX® 10 field programmable gate array (FPGA) IC featuring 25,000 logic elements, 691,200 total RAM bits and 101 general-purpose I/Os in a 144-LQFP exposed pad surface-mount package. It provides a compact, integrated FPGA option for designs that require on-chip memory and a moderate I/O count in a standard package.

Qualified to AEC-Q100 and rated for operation from -40 °C to 125 °C with a supply voltage range of 2.85 V to 3.465 V, this device is targeted at applications that need automotive-grade qualification and extended temperature operation while maintaining RoHS compliance.

Key Features

• Logic Fabric  25,000 logic elements combined with 1,563 logic blocks provide programmable resources for control, interfacing and custom logic implementations.
• On-chip Memory  691,200 total RAM bits support buffering, small data stores and deterministic on-chip memory usage for FPGA logic.
• I/O Count  101 I/Os enable connection to multiple sensors, actuators and peripheral interfaces while supporting system-level interconnects.
• Automotive Qualification  AEC-Q100 qualification and an operating temperature range of -40 °C to 125 °C make the device suitable for automotive applications that require component-level qualification.
• Power Supply  Designed for a supply range of 2.85 V to 3.465 V to match system power rails and simplify integration into existing power architectures.
• Package and Mounting  144-LQFP exposed pad package in a 20 × 20 mm outline with surface-mount mounting type offers a compact footprint with thermal pad for board-level thermal management.
• Environmental Compliance  RoHS-compliant construction supports regulatory requirements for lead-free assembly.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and extended temperature range enable use in in-vehicle control and sensor-interface functions that require reliable operation across automotive temperature extremes.
• Embedded control and interfacing  The combination of 25,000 logic elements and 101 I/Os supports custom control logic, protocol bridging and sensor/actuator interfacing in compact embedded systems.
• On-board data buffering  691,200 RAM bits provide local memory for buffering, small data queues and state storage for real-time processing tasks.

Unique Advantages

• Automotive-grade qualification: AEC-Q100 qualification provides documented component-level suitability for automotive designs.
• Wide operating temperature: Rated from -40 °C to 125 °C to meet harsh-environment requirements without derating design choices.
• Balanced integration: 25,000 logic elements with substantial on-chip RAM reduce the need for external components and simplify board-level design.
• Flexible I/O count: 101 I/Os accommodate multiple sensor and peripheral interfaces, reducing external multiplexing or expansion needs.
• Standard surface-mount package: 144-LQFP exposed pad package supports efficient PCB assembly and board-level thermal management.
• RoHS-compliant: Supports lead-free assembly and regulatory compliance for modern manufacturing processes.

Why Choose 10M25SCE144A7G?

The 10M25SCE144A7G positions itself as a robust, automotive-qualified FPGA option that balances logic capacity, on-chip memory and I/O density in a compact 144-LQFP exposed pad package. Its AEC-Q100 qualification, wide operating temperature range and RoHS compliance make it suitable for designs that require long-term reliability in demanding environments.

Engineers and procurement teams looking for a field-programmable device that integrates moderate logic resources, significant on-chip RAM and a high I/O count will find this device suitable for embedded control, automotive interface and board-level integration tasks where component qualification and temperature resilience matter.

Request a quote or submit a procurement inquiry for the 10M25SCE144A7G to receive pricing, availability and ordering information.