10M25SAE144C8G

IC FPGA 101 I/O 144EQFP
Part Description

MAX® 10 Field Programmable Gate Array (FPGA) IC 101 691200 25000 144-LQFP Exposed Pad

Quantity 1,894 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O101Voltage2.85 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1563Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits691200

Overview of 10M25SAE144C8G – MAX® 10 Field Programmable Gate Array (FPGA), 25,000 logic elements, 691,200 RAM bits, 101 I/Os

The 10M25SAE144C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC offered in a 144-LQFP exposed pad package for surface-mount assembly. It provides 25,000 logic elements and 691,200 total RAM bits, with 101 available I/Os, targeting compact, configurable digital designs.

This commercial-grade device operates from a 2.85 V to 3.465 V supply and is specified for an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and supplied in a 144-pin LQFP form factor (supplier device package: 144-EQFP, 20×20).

Key Features

  • Core Density  25,000 logic elements to implement mid-range programmable logic functions and custom digital architectures.
  • On‑Chip Memory  691,200 total RAM bits to support buffering, FIFOs, and local data storage for embedded logic.
  • I/O Count  101 general-purpose I/Os to connect sensors, peripherals, and external interfaces directly to the FPGA fabric.
  • Power Supply  Operates from 2.85 V to 3.465 V, enabling compatibility with a range of 3V-class systems.
  • Package & Mounting  144-LQFP exposed pad package (supplier package: 144‑EQFP, 20×20) designed for surface-mount assembly and compact PCB layouts.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Environmental Compliance  RoHS compliant for adherence to common lead-free manufacturing requirements.

Unique Advantages

  • High logic capacity: 25,000 logic elements provide substantial programmable resources for custom digital functions without moving to larger device families.
  • Significant on-chip memory: 691,200 RAM bits reduce reliance on external memory for many buffering and data-path tasks.
  • Generous I/O availability: 101 I/Os enable direct interfacing to multiple peripherals and system buses, simplifying board-level routing.
  • Compact, manufacturable package: 144-LQFP exposed pad in a 20×20 supplier package supports surface-mount assembly and dense PCB integration.
  • Commercial-grade suitability: Defined 0 °C to 85 °C operating range and RoHS compliance for standard commercial product lines.

Why Choose 10M25SAE144C8G?

The 10M25SAE144C8G balances programmable logic capacity, on-chip memory, and I/O count in a compact, surface-mount 144‑pin package. Its 25,000 logic elements and 691,200 RAM bits make it well suited for designs that require substantial on‑chip resources while maintaining a moderate footprint and commercial temperature operation.

Choose this device for commercial embedded and digital applications that require a configurable FPGA with robust on-chip RAM, ample I/O, and a manufacturable 144-LQFP exposed pad package. The defined voltage and temperature ranges, together with RoHS compliance, support predictable integration into standard production environments.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the 10M25SAE144C8G.

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