10M25SAE144C8G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 101 691200 25000 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,894 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 101 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1563 | Number of Logic Elements/Cells | 25000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 691200 |
Overview of 10M25SAE144C8G – MAX® 10 Field Programmable Gate Array (FPGA), 25,000 logic elements, 691,200 RAM bits, 101 I/Os
The 10M25SAE144C8G is a MAX® 10 Field Programmable Gate Array (FPGA) IC offered in a 144-LQFP exposed pad package for surface-mount assembly. It provides 25,000 logic elements and 691,200 total RAM bits, with 101 available I/Os, targeting compact, configurable digital designs.
This commercial-grade device operates from a 2.85 V to 3.465 V supply and is specified for an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and supplied in a 144-pin LQFP form factor (supplier device package: 144-EQFP, 20×20).
Key Features
- Core Density 25,000 logic elements to implement mid-range programmable logic functions and custom digital architectures.
- On‑Chip Memory 691,200 total RAM bits to support buffering, FIFOs, and local data storage for embedded logic.
- I/O Count 101 general-purpose I/Os to connect sensors, peripherals, and external interfaces directly to the FPGA fabric.
- Power Supply Operates from 2.85 V to 3.465 V, enabling compatibility with a range of 3V-class systems.
- Package & Mounting 144-LQFP exposed pad package (supplier package: 144‑EQFP, 20×20) designed for surface-mount assembly and compact PCB layouts.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial applications.
- Environmental Compliance RoHS compliant for adherence to common lead-free manufacturing requirements.
Unique Advantages
- High logic capacity: 25,000 logic elements provide substantial programmable resources for custom digital functions without moving to larger device families.
- Significant on-chip memory: 691,200 RAM bits reduce reliance on external memory for many buffering and data-path tasks.
- Generous I/O availability: 101 I/Os enable direct interfacing to multiple peripherals and system buses, simplifying board-level routing.
- Compact, manufacturable package: 144-LQFP exposed pad in a 20×20 supplier package supports surface-mount assembly and dense PCB integration.
- Commercial-grade suitability: Defined 0 °C to 85 °C operating range and RoHS compliance for standard commercial product lines.
Why Choose 10M25SAE144C8G?
The 10M25SAE144C8G balances programmable logic capacity, on-chip memory, and I/O count in a compact, surface-mount 144‑pin package. Its 25,000 logic elements and 691,200 RAM bits make it well suited for designs that require substantial on‑chip resources while maintaining a moderate footprint and commercial temperature operation.
Choose this device for commercial embedded and digital applications that require a configurable FPGA with robust on-chip RAM, ample I/O, and a manufacturable 144-LQFP exposed pad package. The defined voltage and temperature ranges, together with RoHS compliance, support predictable integration into standard production environments.
Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the 10M25SAE144C8G.

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