10M25SAE144I7G

The 10M25SAE144I7G is an Intel MAX® 10 FPGA device providing 25,000 logic elements, 691,200 total RAM bits, and 101 I/O pins in a 144-LQFP exposed pad package. It is supplied as a surface-mount IC and is specified for industrial-grade operation.

With a rated voltage supply range of 2.85 V to 3.465 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require mid-range logic density, substantial on-chip RAM, and a robust surface-mount package footprint.

Key Features

• Logic Capacity — 25,000 logic elements provide mid-range programmable logic resources for control, glue-logic, and custom data paths.
• On‑Chip Memory — 691,200 total RAM bits available for buffering, state storage, and small lookup tables.
• Input/Output — 101 I/O pins to support multiple peripherals, sensor interfaces, and parallel or serial connectivity requirements.
• Power Supply — Operates from 2.85 V to 3.465 V, enabling integration into systems with common mid-level supply rails.
• Package and Mounting — 144-LQFP exposed pad package (supplier package: 144-EQFP 20×20) optimized for surface-mount assembly and board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial thermal ranges.
• RoHS Compliance — Device is RoHS compliant, supporting lead‑free manufacturing processes.

Typical Applications

• Industrial Control — Use the device where industrial temperature range and a flexible I/O count are needed for sensor, actuator, and control logic integration.
• Embedded Processing and Glue Logic — Leverage 25,000 logic elements and on‑chip RAM for custom data paths, protocol conversion, and peripheral control.
• I/O‑Intensive Interfaces — With 101 I/O pins, the device can handle multiple parallel or mixed-signal interface requirements on a single FPGA.
• Surface‑Mount Board Designs — The 144-LQFP exposed pad package suits compact, manufacturable surface-mount assemblies requiring an exposed pad for improved board connection.

Unique Advantages

• Substantial Logic Resources: 25,000 logic elements provide the capacity to implement complex finite-state machines, custom accelerators, and control logic without external logic devices.
• Large On‑Chip RAM: 691,200 bits of RAM reduce reliance on external memory for buffering and small data stores, simplifying BOM and board routing.
• Generous I/O Count: 101 I/O pins offer flexibility to connect multiple sensors, actuators, and peripheral interfaces directly to the FPGA fabric.
• Industrial Thermal Range: Specified from −40 °C to 100 °C to meet common industrial environmental requirements.
• Surface‑Mount, Exposed‑Pad Package: 144-LQFP exposed pad supports reliable solder mounting and board-level thermal/ground connection practices.
• RoHS Compliant: Supports lead‑free assembly processes for regulatory and manufacturing consistency.

Why Choose 10M25SAE144I7G?

The 10M25SAE144I7G positions itself as a mid-density MAX® 10 FPGA option that balances programmable logic capacity, substantial on-chip RAM, and a high I/O count in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for production environments where temperature range and manufacturability are key considerations.

This device is well suited to engineers and procurement teams designing industrial embedded systems, control interfaces, and I/O-heavy subsystems that require integrated logic and memory resources while maintaining a standard surface-mount footprint.

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