10M25DCF484I6G

The 10M25DCF484I6G is an Intel MAX® 10 Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded systems. It combines a mid-range logic capacity with abundant on-chip RAM and high I/O density in a compact 484-BGA package.

This device is tailored for industrial applications that require up to 25,000 logic elements, 691,200 bits of on-chip RAM, and 360 I/O pins, while supporting a 1.15 V to 1.25 V core supply and an extended operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic — 25,000 logic elements for flexible FPGA implementation of custom digital functions and control logic.
• On‑Chip Memory — 691,200 total RAM bits to support buffering, packet processing, and local data storage without external memory.
• I/O Density — 360 I/O pins to support multiple parallel interfaces and high-channel-count systems.
• Power — Core supply voltage range of 1.15 V to 1.25 V to match modern low-voltage system rails.
• Package & Mounting — 484-BGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for board-level integration.
• Industrial Grade — Grade: Industrial with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial control systems — Use the device’s industrial grade temperature range and plentiful I/O to implement motor control, PLC I/O aggregation, and fieldbus interface logic.
• Networking and communications — Leverage the on-chip RAM and 360 I/O pins for packet buffering, protocol bridging, and interface adaptation.
• Embedded measurement and instrumentation — Deploy the FPGA for real-time data acquisition and preprocessing where local memory and deterministic logic are required.

Unique Advantages

• High integration density: 25,000 logic elements and significant on‑chip RAM reduce the need for external components and simplify BOM.
• Large on‑chip RAM: 691,200 RAM bits enable internal buffering and local data processing without immediate reliance on external memory.
• High I/O capacity: 360 I/O pins provide flexibility to connect multiple sensors, interfaces, and peripherals directly to the FPGA fabric.
• Industrial readiness: Rated for −40 °C to 100 °C operation and specified as Industrial grade for deployment in demanding environments.
• Compact, board-friendly package: 484-FBGA (23×23) surface-mount package allows for dense PCB integration while maintaining thermal and electrical performance.
• Low-voltage core operation: 1.15 V to 1.25 V supply supports integration with modern low-voltage systems.

Why Choose 10M25DCF484I6G?

The 10M25DCF484I6G positions itself as a mid-density, industrial-grade FPGA that balances logic capacity, on-chip memory, and I/O density in a compact BGA package. It is suitable for designs that require substantial local memory and a high number of I/O channels while operating across an extended temperature range.

Backed by Intel’s MAX® 10 device family documentation, this part is an option for engineering teams building industrial control, communications, and embedded instrumentation systems that need deterministic logic, integrated RAM, and robust operating-temperature support.

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