10M25DCF256I7G

The 10M25DCF256I7G is a MAX® 10 field programmable gate array (FPGA) IC from Intel, provided in a 256-LBGA package. This industrial-grade FPGA combines a substantial logic capacity with on-chip RAM and a high I/O count for configurable digital designs.

Key device attributes include 25,000 logic elements, 691,200 total RAM bits, 178 I/Os, a 1.15 V–1.25 V supply range, and an operating temperature range of −40 °C to 100 °C, making it suitable for demanding industrial environments.

Key Features

• Core Logic  25,000 logic elements provide flexible, reprogrammable fabric for custom digital functions and control logic.
• Memory  691,200 total RAM bits available for on-chip data buffering, FIFOs, and small lookup tables.
• I/O and Integration  178 I/Os support extensive peripheral interfacing and board-level signal connectivity.
• Power  Recommended operating supply range of 1.15 V to 1.25 V for core power delivery.
• Package and Mounting  256-LBGA package (supplier device package: 256-FBGA, 17 × 17) designed for surface-mount assembly to save board area.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature-challenging environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the FPGA’s logic capacity and extensive I/O to implement control algorithms, machine interfaces, and I/O aggregation in industrial equipment.
• Embedded Processing and Custom Logic  On-chip RAM and reprogrammable logic make it suitable for implementing application-specific processing blocks and prototyping custom algorithms.
• I/O Bridging and Interface Conversion  High I/O count and compact package enable board-level protocol bridging and interface adaptation where multiple signals must be managed.

Unique Advantages

• High logic capacity: 25,000 logic elements enable complex logic implementations without immediate migration to larger devices.
• Generous on-chip RAM: 691,200 RAM bits reduce dependence on external memory for many buffering and low-latency storage needs.
• Substantial I/O density: 178 I/Os support multiple peripherals and interfaces on a single device, simplifying board-level routing.
• Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact surface-mount package: 256-LBGA / 256-FBGA (17 × 17) saves PCB area while delivering high integration.
• RoHS compliant: Meets environmental requirements for lead-free manufacturing.

Why Choose 10M25DCF256I7G?

The 10M25DCF256I7G balances significant logic resources, on-chip memory, and a high I/O count in a compact, surface-mount 256-LBGA package targeted at industrial applications. Its specified voltage range and wide operating temperature make it a practical choice where reconfigurable logic and dependable operation across temperature extremes are required.

This device suits teams and designs that need configurable digital logic with integrated RAM and plentiful I/O capacity while maintaining a compact board footprint and industrial temperature capability.

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