10M25DCF256C8G

The 10M25DCF256C8G is a MAX® 10 Field Programmable Gate Array (FPGA) offered in a compact 256-LBGA package for surface-mount applications. It provides a balance of programmable logic, on-chip memory, and I/O resources targeted at commercial-grade embedded designs.

With 25,000 logic elements, 691,200 bits of RAM and 178 I/Os, this device suits applications that require moderate logic density, integrated memory, and a high pin count within a low-voltage, commercial-temperature platform.

Key Features

• Programmable Logic — 25,000 logic elements for implementing custom logic, state machines, and glue logic within the FPGA fabric.
• On‑Chip Memory — 691,200 total RAM bits provide local storage for buffering, lookup tables, and temporary data structures.
• I/O Capability — 178 general-purpose I/Os to interface with peripherals, sensors, and external components.
• Power — Operates from a supply range of 1.15 V to 1.25 V to support low-voltage system designs.
• Package & Mounting — 256-LBGA (supplier device package: 256-FBGA 17×17) in a surface-mount form factor for compact board layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
• RoHS Compliant — Meets RoHS requirements for restriction of hazardous substances.

Typical Applications

• Commercial Embedded Systems — Implement control logic and custom peripheral interfaces using the device’s 25,000 logic elements and 178 I/Os.
• Communications and Networking — Use the 691,200 bits of on-chip RAM and abundant I/O for packet buffering, protocol bridging, and interface adaptation.
• Industrial Automation (Commercial Grade) — Integrate discrete control, sensor aggregation, and user-interface handling within a commercial-temperature FPGA platform.

Unique Advantages

• Balanced Logic Density: 25,000 logic elements provide capacity for medium-complexity designs without excessive board-level components.
• Integrated RAM: 691,200 bits of on-chip memory reduce the need for external RAM in many buffering and lookup scenarios.
• High I/O Count: 178 I/Os enable direct connections to multiple peripherals and parallel interfaces, simplifying PCB routing and system architecture.
• Compact LBGA Package: 256-LBGA (17×17) offers a small footprint for space-constrained boards while supporting surface-mount assembly.
• Low-Voltage Operation: 1.15 V to 1.25 V supply range supports integration into low-power system designs.
• Commercial Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for deployment in standard commercial environments.

Why Choose 10M25DCF256C8G?

The 10M25DCF256C8G positions itself as a commercial-grade, mid-density FPGA that combines substantial programmable logic, significant on-chip RAM, and a high I/O count in a compact 256-LBGA package. It is suitable for designers who need to consolidate functions, reduce external components, and implement custom logic within a standard commercial-temperature platform.

Choose this MAX® 10 device when your design requires a balanced mix of logic capacity, integrated memory, and flexible I/O in a surface-mount form factor capable of meeting RoHS requirements.

Request a quote or submit an inquiry today to get pricing and availability for the 10M25DCF256C8G.