10M25DCF256C7G

The 10M25DCF256C7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC delivering 25,000 logic elements and 691,200 total RAM bits in a compact 256-ball BGA package. It combines substantial logic and on-chip memory with a high I/O count to address mid-range programmable logic requirements in commercial applications.

Designed for surface-mount assembly, this device operates from a 1.15 V to 1.25 V supply and is specified for commercial temperature use (0 °C to 85 °C), making it suitable for a wide range of general-purpose embedded designs.

Key Features

• Core Logic 25,000 logic elements provide the programmable fabric required for custom logic, glue-logic, and moderate-density FPGA functions.
• On-Chip Memory 691,200 total RAM bits for buffering, state storage, and data path implementation without external memory.
• I/O Resources 178 I/O pins enable broad external connectivity for sensors, peripherals, and interface logic.
• Power Operates from a 1.15 V to 1.25 V supply range to meet core voltage requirements typical of this class of FPGA.
• Package & Mounting 256-LBGA package (supplier device package: 256-FBGA 17×17) in a surface-mount format for compact board-level integration.
• Temperature & Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant for reduced hazardous substances in manufacturing and deployment.

Typical Applications

• Embedded control and logic consolidation — Suited for designs that require up to 25,000 logic elements and significant on-chip RAM for control logic and state machines.
• I/O-intensive interface bridging — With 178 I/Os, the device supports boards that need multiple peripheral interfaces, protocol translation, or glue logic between subsystems.
• Signal buffering and data handling — 691,200 bits of on-chip RAM provide capacity for buffering, FIFOs, and intermediate data storage in data-path applications.

Unique Advantages

• High logic capacity: 25,000 logic elements deliver ample programmable resources for mid-range FPGA implementations, reducing the need for multiple discrete components.
• Substantial on-chip RAM: 691,200 total RAM bits enable internal buffering and state storage, simplifying board-level memory requirements.
• Extensive I/O: 178 I/O pins provide flexibility for complex interfacing and multiple peripheral connections without external multiplexers.
• Compact BGA footprint: 256-ball BGA (256-FBGA, 17×17) supports high-density board designs while maintaining surface-mount assembly compatibility.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance align with standard commercial product requirements and manufacturing practices.

Why Choose 10M25DCF256C7G?

The 10M25DCF256C7G positions itself as a capable mid-range FPGA option that balances logic density, on-chip memory, and I/O capacity in a compact surface-mount package. Its combination of 25,000 logic elements, 691,200 RAM bits, and 178 I/Os makes it appropriate for embedded systems, interface bridging, and data-handling tasks within commercial temperature environments.

For designers and procurement teams seeking a programmable device that offers integration of logic, memory, and connectivity while maintaining RoHS compliance and standard commercial-grade specifications, this MAX® 10 part provides a clear, specification-driven choice that supports scalable and maintainable designs.

Request a quote or submit a purchasing inquiry for part number 10M25DCF256C7G to receive pricing, availability, and lead-time information.