10M25DAF484I7G

The 10M25DAF484I7G is a MAX® 10 Field Programmable Gate Array that delivers mid-density programmable logic in a compact 484-BGA package. It provides approximately 25,000 logic elements and 1,563 LABs along with 691,200 bits of on-chip RAM and 360 I/O pins for designs requiring substantial logic, memory, and connectivity on a single device.

Designed for industrial applications, this surface-mount FPGA operates from a 1.15 V to 1.25 V supply and across an operating temperature range of −40 °C to 100 °C, enabling deployment in environments that demand extended temperature tolerance and regulatory compliance with RoHS.

Key Features

• Core Logic  Approximately 25,000 logic elements and 1,563 LABs provide the programmable resources for custom logic implementation and hardware acceleration.
• On‑Chip Memory  691,200 total RAM bits available for buffering, state storage, and memory-intensive logic functions.
• I/O Density  360 available I/O pins to support multiple interfaces, peripherals, and cross-domain signaling points.
• Power  Nominal voltage supply range of 1.15 V to 1.25 V to match design power budgets and supply rails.
• Package and Mounting  484-BGA package in a 484-FBGA (23×23) supplier device package; intended for surface-mount PCB assembly.
• Temperature and Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for wide-temperature deployments.
• Environmental Compliance  RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Industrial Automation  Use the industrial-grade temperature range and high I/O count to interface sensors, actuators, and control buses in automation systems.
• Embedded Acceleration  Deploy on-chip logic and RAM to offload and accelerate compute-intensive tasks in embedded platforms.
• High‑Connectivity Systems  Leverage 360 I/O pins and substantial RAM for bridging, protocol handling, and multi-interface connectivity in communication equipment.
• Compact Product Integration  The 484-BGA surface-mount package enables integration into space-constrained PCBs while retaining robust logic and memory resources.

Unique Advantages

• Balanced Logic and Memory:  Approximately 25,000 logic elements paired with 691,200 RAM bits provide a balance of compute and storage for diverse FPGA tasks.
• High I/O Capacity:  360 I/O pins support complex interfacing and multiple peripheral connections without external multiplexing.
• Industrial Temperature Rating:  Operates from −40 °C to 100 °C to meet the demands of extended-temperature applications.
• Compact BGA Packaging:  484-FBGA (23×23) surface-mount package enables dense PCB layouts and production-ready assembly.
• Regulatory Compatibility:  RoHS compliance supports lead-free manufacturing flows and regulatory requirements.

Why Choose 10M25DAF484I7G?

The 10M25DAF484I7G positions mid-density programmable logic, substantial on-chip memory, and a high I/O count into a single industrial-grade 484-BGA package. This combination supports designs that require reliable operation across a wide temperature range while maintaining compact board footprint and strong interface capability.

It is well suited for engineers and product teams building industrial and embedded systems that need scalable programmable resources, on-board RAM, and abundant I/O in a surface-mount form factor—delivering a practical balance of integration, connectivity, and environmental robustness.

If you would like pricing or availability information for the 10M25DAF484I7G, submit a request for a quote or an inquiry through your usual procurement channels and our team will respond with details.