10M25DAF484A7G

The 10M25DAF484A7G is an Intel MAX® 10 field programmable gate array (FPGA) provided in a 484-ball BGA package. It delivers 25,000 logic elements and on-chip memory totaling 691,200 bits, making it suitable for designs that require significant programmable logic and embedded RAM within a compact surface-mount package.

This device is offered as an automotive-grade part with AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C, and is specified for core supply voltages from 1.15 V to 1.25 V.

Key Features

• Logic Resources  25,000 logic elements to implement custom logic, state machines, and datapath functions.
• On-chip Memory  691,200 total RAM bits for buffering, FIFOs, and embedded data storage without external memory.
• I/O Capacity  360 I/O pins to support high-pin-count interfaces and multiple peripheral connections.
• Automotive Qualification  AEC‑Q100 qualification and an Automotive grade designation, supporting automotive system requirements.
• Operating Range  Specified operating temperature range from −40 °C to 125 °C for temperature-critical deployments.
• Core Voltage  Core supply specified between 1.15 V and 1.25 V.
• Package & Mounting  484‑ball FBGA (23 × 23) package, surface-mount assembly for compact board-level integration.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Automotive systems  AEC‑Q100 qualified FPGA suitable for electronic control units and other automotive electronic modules requiring programmable logic.
• High‑I/O custom logic  Designs that need extensive I/O connectivity—up to 360 pins—for interfacing multiple peripherals and sensors.
• On‑chip memory–dependent designs  Applications that rely on substantial internal RAM for buffering, data aggregation, or real‑time processing.
• Temperature‑sensitive deployments  Systems operating across −40 °C to 125 °C where component temperature range is critical.

Unique Advantages

• High logic density: 25,000 logic elements provide significant programmable capacity for mid-density FPGA designs.
• Large embedded RAM: 691,200 bits of on‑chip RAM reduce dependence on external memory and simplify board-level BOM.
• Extensive I/O count: 360 I/O pins enable flexible interfacing to multiple buses, sensors, and peripherals.
• Automotive‑grade qualification: AEC‑Q100 qualification supports use in automotive electronic designs that require qualified components.
• Wide operating temperature: −40 °C to 125 °C rating supports deployments across harsh thermal environments.
• Compact high‑pin‑count package: 484‑ball FBGA (23×23) provides a high‑density footprint for space-constrained boards.

Why Choose 10M25DAF484A7G?

The 10M25DAF484A7G positions itself as a mid-density MAX® 10 FPGA option that balances sizeable logic capacity, substantial on‑chip RAM, and high I/O availability in a compact 484‑BGA package. Its AEC‑Q100 qualification and wide operating temperature range make it appropriate for designs that require automotive-grade components and robust thermal performance.

This device is suitable for engineers designing systems that need integrated memory, extensive I/O, and qualified componentry while maintaining a compact board footprint. Documentation for the Intel MAX® 10 family provides detailed electrical and timing specifications to support development and verification efforts.

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