10M25DAF256I7G

The 10M25DAF256I7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, packaged in a 256-LBGA surface-mount format. It provides a mid-range logic capacity with integrated RAM and extensive I/O in a device graded for industrial operation.

With 25,000 logic elements, 691,200 bits of on-chip RAM and 178 I/Os, this device suits industrial and embedded designs that require reprogrammable logic, compact packaging and operation across a wide temperature range.

Key Features

• Core Logic  25,000 logic elements deliver reprogrammable hardware resources for custom logic and acceleration.
• On‑Chip Memory  691,200 total RAM bits provide local storage for buffering, state machines and small data structures.
• High I/O Count  178 general-purpose I/Os support extensive external interfacing without large amounts of additional glue logic.
• Power  Operates from a 1.15 V to 1.25 V supply voltage to match low‑voltage system domains.
• Package & Mounting  256-LBGA surface-mount package (supplier device package: 256-FBGA 17×17) for compact board-level integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control Systems  Use the 25,000 logic elements and 178 I/Os to implement custom control, sequencing and I/O aggregation in industrial equipment within an industrial temperature range.
• Embedded Processing and Peripheral Offload  Deploy on-chip RAM alongside configurable logic to accelerate tasks or offload peripheral handling from a host processor.
• Sensor and Actuator Interfaces  Leverage the high I/O count for direct sensor interfacing, multiplexing and real-time signal conditioning in embedded systems.
• Communication and Bridging  Implement protocol bridging and signal routing using the device’s logic density and plentiful I/Os for board-level integration.

Unique Advantages

• Significant Logic Capacity: 25,000 logic elements enable complex custom logic implementations while keeping board count and external components down.
• Large On‑Chip RAM: 691,200 bits of RAM reduce dependence on external memory for buffering and state storage.
• Extensive External Connectivity: 178 I/Os simplify direct connection to sensors, peripherals and external devices, minimizing glue logic.
• Industrial‑Ready Operation: Rated for −40 °C to 100 °C and specified as industrial grade for reliable performance in challenging environments.
• Compact Surface‑Mount Package: 256-LBGA (256-FBGA 17×17) supports dense board layouts and automated assembly.
• Low‑Voltage Operation: 1.15 V to 1.25 V supply range supports integration with low-voltage system domains.

Why Choose 10M25DAF256I7G?

The 10M25DAF256I7G positions itself as a versatile MAX® 10 FPGA option for designers who need a balance of logic density, on‑chip memory and a high I/O count in an industrial-grade package. Its combination of 25,000 logic elements, substantial RAM and 178 I/Os makes it suitable for embedded, industrial and board-level integration tasks where reprogrammable logic and compact packaging are priorities.

Backed by Intel's MAX® 10 FPGA product line, the device supports designs that require scalable logic capacity and reliable operation across a wide temperature range while adhering to RoHS environmental requirements.

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