10M25DAF256A7G

The 10M25DAF256A7G is an Intel MAX 10 field programmable gate array supplied in a 256-pin L-BGA surface-mount package. It integrates approximately 25,000 logic elements and 691,200 bits of on-chip RAM, delivering a compact programmable logic solution with a high I/O count.

Qualified to AEC-Q100 and specified for an operating range of –40 °C to 125 °C with a core supply of 1.15 V to 1.25 V, this device is targeted at designs that require automotive-grade qualification and extended temperature operation while maintaining a small package footprint.

Key Features

• Core Logic  Approximately 25,000 logic elements provide the programmable fabric needed for medium-density logic integration.
• On-chip Memory  691,200 total RAM bits for embedded buffers, FIFOs, and small local memories.
• I/O Capacity  178 user I/O pins to support multiple interfaces and peripheral connections directly from the FPGA.
• Automotive Qualification  AEC-Q100 qualification and explicit Automotive grade designation for use in environments that require automotive-level component qualification.
• Package and Mounting  256-LBGA package (supplier package listed as 256-FBGA 17×17) in a surface-mount form factor for PCB space efficiency.
• Power and Thermal  Core supply range of 1.15 V to 1.25 V and an operating temperature specification from –40 °C to 125 °C for robust thermal performance.
• Regulatory Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• Automotive-grade qualification: AEC-Q100 qualification and Automotive grade designation reduce component validation overhead for automotive applications.
• Balanced integration: Combines ~25,000 logic elements with 691,200 bits of RAM to consolidate discrete logic and small memory functions into a single device.
• High I/O density: 178 I/O pins enable flexible sensor, actuator, and peripheral interfacing without external expander components.
• Wide operating range: Specified operation from –40 °C to 125 °C supports deployment across demanding temperature environments.
• Compact surface-mount package: 256-LBGA/256-FBGA (17×17) format saves PCB area while supporting high-density routing.
• Low-voltage core operation: 1.15 V–1.25 V supply minimizes core power and aligns with modern low-voltage system architectures.

Why Choose 10M25DAF256A7G?

The 10M25DAF256A7G positions itself as a reliable, automotive-qualified FPGA option that balances logic capacity, embedded RAM, and I/O density in a compact L-BGA package. Its AEC-Q100 qualification and extended temperature rating make it suitable for designs where component-level automotive qualification and thermal robustness are required.

This device is well suited for engineers who need a scalable, programmable logic building block with verified automotive qualification, a strong on-chip memory complement, and ample I/O — enabling consolidation of functions, reduced external components, and straightforward integration into space-constrained PCBs.

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