10M16SCU324I7G

The 10M16SCU324I7G is an Intel MAX® 10 field programmable gate array (FPGA) provided in a 324-LFBGA package. It delivers a balanced combination of programmable logic capacity, on-chip RAM, and a high I/O count in an industrial-grade device.

Specified for a 2.85 V to 3.465 V supply and an operating temperature range of −40 °C to 100 °C, this FPGA is positioned for designs that require verified operating range, substantial logic and memory resources, and a compact BGA footprint.

Key Features

• Core Architecture  MAX® 10 FPGA family from Intel, provided as a field-programmable device for implementation of custom logic.
• Logic Capacity  16,000 logic elements for implementing moderate to complex digital logic functions.
• Embedded Memory  562,176 total RAM bits to support on-chip buffering, state storage, and memory-intensive logic.
• I/O Resources  246 general-purpose I/O pins to support wide external connectivity and parallel interfaces.
• Package & Mounting  324-LFBGA package (supplier device package: 324-UBGA, 15 × 15 mm) with surface-mount mounting for compact board integration.
• Power Supply  Supports a 2.85 V to 3.465 V supply range to match common system voltage rails.
• Temperature & Grade  Industrial grade, rated for operation from −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density I/O systems  Use the 246 I/O pins for boards requiring extensive external device interfacing or parallel bus connections.
• Logic-intensive designs  Leverage 16,000 logic elements to implement custom control, protocol bridging, or signal processing logic.
• Memory-buffered workflows  Utilize 562,176 RAM bits for on-chip buffering, packet storage, and state machines that require substantial local memory.
• Industrial embedded systems  The industrial-grade temperature range (−40 °C to 100 °C) makes this FPGA suitable for controls and instrumentation in demanding environments.

Unique Advantages

• Significant on-chip memory: 562,176 RAM bits reduce reliance on external memory for many buffering and stateful tasks.
• Robust I/O count: 246 I/O pins provide flexibility for complex interfacing and multi-channel designs.
• Compact BGA packaging: 324-LFBGA (15 × 15 mm) enables high-density board layouts while maintaining a standard surface-mount footprint.
• Industrial temperature rating: Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
• Wide supply compatibility: 2.85 V to 3.465 V supply range aligns with common system power rails for straightforward integration.
• Regulatory alignment: RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose 10M16SCU324I7G?

The 10M16SCU324I7G combines a MAX® 10 FPGA architecture with 16,000 logic elements, substantial on-chip RAM, and a high I/O count in a compact 324-LFBGA package. Its industrial-grade temperature rating and RoHS compliance make it a pragmatic choice when reliability and regulatory alignment are required alongside programmable logic capability.

This device is well suited to design teams seeking a balanced FPGA solution for mid-density logic implementations, memory-buffered processing, and extensive external interfacing, all within a surface-mount BGA form factor and a defined supply and temperature envelope.

If you would like pricing, availability, or to request a formal quote for the 10M16SCU324I7G, please submit a quote request or contact our sales team through the provided inquiry channel.