10M16SCU169C8G
| Part Description |
MAX® 10 Field Programmable Gate Array (FPGA) IC 130 562176 16000 169-LFBGA |
|---|---|
| Quantity | 325 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 169-UBGA (11x11) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 169-LFBGA | Number of I/O | 130 | Voltage | 2.85 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 16000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 562176 |
Overview of 10M16SCU169C8G – MAX® 10 Field Programmable Gate Array (FPGA), 16,000 Logic Elements, 169-LFBGA
The 10M16SCU169C8G is a MAX® 10 Field Programmable Gate Array (FPGA) offered in a 169-LFBGA package. It provides a mid-range programmable logic resource with on‑chip RAM and a high I/O count for flexible system integration.
Designed for commercial‑grade electronic designs, this FPGA delivers a balance of logic capacity, embedded memory, and interfacing capability within a compact surface‑mount BGA footprint.
Key Features
- Core Capacity 16,000 logic elements providing programmable logic resources for custom digital implementations.
- Embedded Memory 562,176 total RAM bits available for data buffering, lookup tables, and local storage.
- I/O 130 I/O pins to support multiple interfaces and peripheral connections on a single device.
- Power Operates from a supply range of 2.85 V to 3.465 V, enabling compatibility with common commercial power domains.
- Package & Mounting 169-LFBGA (supplier package: 169-UBGA, 11×11) in a surface‑mount form factor suited to compact PCB designs.
- Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C for standard embedded environments.
- Compliance RoHS compliant for use in designs requiring lead‑free manufacturing practices.
Typical Applications
- Embedded Control Implement custom control logic and glue logic where 16,000 logic elements and on‑chip RAM support deterministic, reconfigurable functions.
- Interface Bridging Use the 130 I/Os to bridge multiple digital peripherals and bus standards within a single compact device.
- Prototyping and Evaluation Mid‑range FPGA capacity and accessible I/O count make it suitable for validating system architectures and iterative development.
Unique Advantages
- Balanced Logic and Memory: The combination of 16,000 logic elements and 562,176 RAM bits supports both combinational logic and local data storage without external SRAM in many designs.
- High I/O Density: 130 I/Os reduce the need for external interface components and simplify board-level connectivity.
- Compact BGA Footprint: 169-LFBGA / 169-UBGA (11×11) package enables space-efficient placement on PCBs while preserving routing density.
- Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial applications where industrial temperature ranges are not required.
- RoHS Compliant: Meets lead‑free manufacturing requirements for modern assembly processes.
- Broad Supply Voltage Support: 2.85 V to 3.465 V operating range allows integration with common system power rails.
Why Choose 10M16SCU169C8G?
The 10M16SCU169C8G positions itself as a practical mid‑range FPGA solution delivering a useful combination of logic capacity, embedded RAM, and substantial I/O in a compact 169‑LFBGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream embedded designs that require reprogrammable logic and flexible interfacing without the need for industrial grading.
Choose this device for projects that need scalable programmable resources, integrated memory, and a high I/O count to simplify board-level design and reduce external component count while maintaining a compact footprint.
Request a quote or submit an inquiry to receive pricing and availability information for the 10M16SCU169C8G.

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