10M16SCU169I7G

The 10M16SCU169I7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, offered in a 169-LFBGA surface-mount package. It provides a balanced combination of logic capacity, on-chip RAM and I/O count for designs that require moderate logic density and substantial embedded memory.

Targeted for industrial applications, this device supports a wide operating temperature range and a standard 2.85 V to 3.465 V supply window, making it suitable for systems that demand reliable operation across extended temperature conditions.

Key Features

• Logic Capacity — 16,000 logic elements to implement custom logic, state machines and moderate-complexity FPGA functions.
• Embedded Memory — 562,176 total RAM bits for on-chip buffering, FIFOs and temporary data storage without external memory.
• I/O Resources — 130 general-purpose I/O pins for interfacing with sensors, peripherals and external devices.
• Power Supply — Operates from 2.85 V to 3.465 V supply rails, allowing integration into a variety of 3.3 V-class power domains.
• Package & Mounting — 169-LFBGA (supplier package listed as 169-UBGA 11×11) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• RoHS Compliant — Manufactured in accordance with RoHS standards.

Typical Applications

• Industrial Control and Automation — Leverages the industrial operating temperature range and plentiful I/O for sensor interfacing, control logic and communication bridging.
• Embedded Processing and Acceleration — Use the 16,000 logic elements and on-chip RAM to implement custom accelerators, protocol handlers or glue logic within embedded systems.
• Communication Interfaces — 130 I/O pins enable aggregation and protocol conversion between multiple serial, parallel or GPIO-based interfaces.

Unique Advantages

• Balanced Logic and Memory — 16,000 logic elements paired with 562,176 RAM bits offer designers the capacity to implement both logic-heavy and memory-dependent functions on a single device.
• Ample I/O Count — 130 I/O pins reduce the need for external multiplexing and simplify board-level routing for multi-peripheral systems.
• Industrial-Grade Temperature Performance — Rated from −40 °C to 100 °C to support reliable operation in industrial environments.
• Compact Surface-Mount Package — 169-LFBGA (169-UBGA 11×11) provides a space-efficient footprint for dense PCBs.
• Standard Voltage Compatibility — Operates on 2.85 V to 3.465 V rails for straightforward integration into common 3.3 V-class systems.
• Regulatory Compliance — RoHS compliance supports deployments where lead-free manufacturing is required.

Why Choose 10M16SCU169I7G?

The 10M16SCU169I7G positions itself as a mid-density MAX® 10 FPGA option that balances logic capacity, embedded RAM and I/O resources in a compact industrial-grade package. Its specification set makes it well suited for designers who need on-chip memory and flexible interfacing while maintaining operation across extended temperature ranges.

Manufactured by Intel and offered in a 169-LFBGA surface-mount package, this device is appropriate for embedded and industrial applications that require a mix of integration, reliability and straightforward power-domain compatibility.

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