10M16SCE144I7G

The 10M16SCE144I7G is an Intel MAX® 10 Field Programmable Gate Array provided in a 144-LQFP exposed pad package. It delivers a mid-density FPGA fabric with 16,000 logic elements, 562,176 bits of on-chip RAM and up to 101 user I/O in a compact surface-mount footprint.

This device is suited to designs that require integrated logic and memory in a single, industrial-grade component, offering a defined operating range and package choices for space-constrained or temperature-challenging applications.

Key Features

• Core Logic  Provides 16,000 logic elements to implement custom digital functions and glue logic within a single FPGA.
• Configurable Memory  Totals 562,176 bits of on-chip RAM to support FIFOs, buffers and local storage without external memory.
• I/O Capacity  Up to 101 user I/O pins, enabling multiple peripheral interfaces and signal connections from the single package.
• Package and Mounting  144-LQFP exposed pad package (supplier device package: 144-EQFP, 20×20) designed for surface-mount assembly and thermal management via the exposed pad.
• Voltage Supply  Operates from 2.85 V to 3.465 V supply range to match common system power rails.
• Industrial Temperature Range  Specified for operation from –40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Custom Logic and Control  Implement control, glue logic and protocol translation using up to 16,000 logic elements and on-chip RAM.
• Embedded System Interfaces  Connect sensors, actuators and peripherals with the device's 101 I/O pins in space-constrained designs.
• Industrial Electronics  Deploy in industrial equipment that requires an FPGA with an extended temperature range (–40 °C to 100 °C) and surface-mount packaging.

Unique Advantages

• Balanced Logic and Memory Capacity: Combines 16,000 logic elements with 562,176 bits of RAM to consolidate logic and data buffering on-chip and reduce external components.
• Generous I/O Count: 101 user I/O pins enable integration of multiple interfaces without board redesign.
• Compact, Thermally Aware Package: 144-LQFP exposed pad (20×20 EQFP form) allows surface-mount assembly while providing a thermal path through the exposed pad.
• Wide Supply Range: 2.85 V to 3.465 V operation accommodates common system power rails for straightforward integration.
• Industrial Temperature Capability: Rated from –40 °C to 100 °C to support deployment in temperature-demanding environments.
• RoHS Compliance: Meets RoHS requirements for assembly and manufacturing processes.

Why Choose 10M16SCE144I7G?

The 10M16SCE144I7G delivers a practical combination of logic density, on-chip RAM and I/O count in a single industrial-grade FPGA package. Its 16,000 logic elements and 562,176 bits of RAM make it suitable for medium-complexity digital designs that benefit from integrated memory and flexible I/O.

Engineers seeking a surface-mount FPGA with a defined operating voltage range and extended temperature rating will find this device appropriate for space- and temperature-constrained applications where consolidation of functions and reduced external BOM are priorities.

Request a quote or submit your inquiry to obtain pricing and availability for the 10M16SCE144I7G.