10M16SCE144C7G

The 10M16SCE144C7G is a MAX® 10 Field Programmable Gate Array (FPGA) IC from Intel, provided in a 144-LQFP exposed pad surface-mount package. It combines 16,000 logic elements, 562,176 total RAM bits, and 101 general-purpose I/Os to support compact commercial designs requiring moderate logic density and on-chip memory.

Designed for commercial-grade applications, the device operates from 0 °C to 85 °C and accepts a supply range of 2.85 V to 3.465 V, enabling straightforward integration into board-level systems that need configurable logic, memory, and I/O capacity in a space-conscious package.

Key Features

• Core Logic  16,000 logic elements (LEs) provide the programmable fabric for implementing custom digital functions and control logic.
• On-Chip Memory  562,176 total RAM bits for data buffering, state storage, and small lookup tables without external memory.
• I/O Count  101 general-purpose I/Os to connect peripherals, sensors, and external interfaces directly to the FPGA fabric.
• Power Supply  Supports a supply voltage range of 2.85 V to 3.465 V to match common system power rails.
• Package and Mounting  144-LQFP exposed pad (Supplier device package: 144-EQFP, 20×20) in a surface-mount form factor for compact board-level implementation.
• Operating Grade and Temperature  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• RoHS Compliance  RoHS-compliant construction to meet common environmental requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom control and interface logic using the 16,000 logic elements and 101 I/Os for compact product designs.
• Board-Level Integration  Use the 144-LQFP exposed pad package to integrate programmable logic into small PCBs where space and package height matter.
• Memory-Intensive Logic  Leverage 562,176 RAM bits for buffering, lookup tables, and small data storage needs without adding external memory components.
• Prototyping and Development  Deploy the MAX® 10 device in commercial design prototypes that require reconfigurable logic and medium I/O counts.

Unique Advantages

• Balanced Logic and Memory: 16,000 logic elements paired with 562,176 RAM bits offer a practical mix of programmable logic and on-chip storage for many commercial designs.
• Generous I/O Density: 101 I/Os enable flexible interfacing to peripherals and external devices without immediate need for expanders.
• Compact Surface-Mount Package: The 144-LQFP exposed pad package (144-EQFP, 20×20) supports compact board layouts and simplifies assembly.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial electronic product environments.
• RoHS-Compliant: Environmentally compliant construction supports regulatory and manufacturing requirements.

Why Choose 10M16SCE144C7G?

The 10M16SCE144C7G delivers a pragmatic combination of programmable logic, on-chip memory, and I/O resources in a compact 144-LQFP exposed pad package, tailored for commercial applications. Its voltage supply range and commercial temperature rating make it suitable for a wide range of board-level designs that need moderate logic density and memory without external additions.

This device is well suited to designers seeking a scalable, vendor-backed FPGA solution for commercial products, prototypes, and integrations where footprint, I/O count, and on-chip RAM are important selection criteria.

Request a quote or submit an inquiry to get pricing and availability for the 10M16SCE144C7G.